XC3S400-5PQ208C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 294912 8064 208-BFQFP |
|---|---|
| Quantity | 315 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 141 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 896 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 400000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 294912 |
Overview of XC3S400-5PQ208C – Spartan®-3 Field Programmable Gate Array (FPGA) IC 141 294912 8064 208-BFQFP
The XC3S400-5PQ208C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD, offered in a 208-pin BFQFP package. It provides a balanced combination of programmable logic, on-chip memory, and I/O density for commercial-grade embedded and digital designs.
With measured resources including logic elements, CLBs, embedded RAM and a substantial I/O count, this device is intended for commercial applications that require reconfigurable digital functionality in a compact surface-mount package.
Key Features
- Core Logic 896 CLBs delivering a total of 8,064 logic elements for implementing custom digital functions and control logic.
- Embedded Memory Approximately 0.295 Mbits of on-chip RAM (294,912 bits) for data buffering, state retention and small memory structures.
- I/O and Gate Capacity 141 general-purpose I/O pins and an internal gate count of 400,000 to support multiple external interfaces and moderate-complexity designs.
- Power Core voltage supply range of 1.14 V to 1.26 V to guide power-supply design and sequencing.
- Package & Mounting 208-BFQFP (208-PQFP, 28 × 28) surface-mount package providing a compact footprint with extensive pinout for system integration.
- Operating Range & Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for typical commercial environments.
- Environmental Compliance RoHS compliant to meet common environmental and regulatory requirements for electronic assemblies.
Typical Applications
- Commercial Embedded Systems — Implement custom control, glue logic, or protocol handling in commercial electronic products using the device's programmable fabric.
- Prototyping and Development — Use the FPGA for iterative design validation and functional prototyping where reconfigurability accelerates development cycles.
- I/O-Intensive Interfaces — Leverage 141 I/O pins for systems that require multiple external connections, sensor interfaces, or peripheral control.
Unique Advantages
- Moderate Logic Capacity: 8,064 logic elements and 896 CLBs provide ample resources for medium-complexity digital implementations without excessive cost or footprint.
- On-Chip RAM: Approximately 0.295 Mbits of embedded memory reduces reliance on external RAM for buffering and small data structures.
- High I/O Count: 141 I/O pins simplify external interfacing and minimize the need for additional I/O expanders.
- Compact Surface-Mount Package: The 208-BFQFP (28 × 28) package balances connectivity and PCB space for compact board designs.
- Commercial-Grade Specification: Specified for 0 °C to 85 °C operation and RoHS compliance for deployment in standard commercial environments.
- Controlled Power Requirements: Defined core voltage range (1.14 V–1.26 V) aids in predictable power-supply integration.
Why Choose XC3S400-5PQ208C?
The XC3S400-5PQ208C is positioned for designers seeking a commercial-grade, reprogrammable logic device with a balanced set of resources: thousands of logic elements, embedded RAM, and an extensive I/O count in a compact surface-mount package. Its specification set supports moderate-complexity digital designs where flexibility, integration and footprint matter.
Backed by AMD's Spartan®-3 family heritage, this FPGA offers a practical platform for development, prototyping, and deployment in commercial electronic products where predictable supply requirements and RoHS compliance are important.
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