XC3S4000-4FG676C

The XC3S4000-4FG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD designed for programmable logic implementations. It combines substantial logic capacity, embedded memory, and a high I/O count in a 676-ball BGA package for surface-mount applications.

Its specification set—including 62,208 logic elements, approximately 1.77 Mbits of embedded memory, and 489 I/O—makes it suitable for designs that require on-chip integration of custom digital functions while operating within commercial temperature and supply ranges.

Key Features

• Logic Capacity  62,208 logic elements provide broad programmable logic resources for implementing complex combinational and sequential designs.
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM (1,769,472 bits) to support buffering, FIFOs, and local data storage for implemented logic.
• Gate Count  Approximately 4,000,000 gates of logic-equivalent capacity to express dense hardware functions and accelerators.
• I/O Resources  489 general-purpose I/O pins to interface with multiple peripherals, buses, and external devices.
• Package & Mounting  676-BGA package (supplier device package: 676-FBGA (27×27)) with surface-mount mounting for compact board-level integration.
• Power Supply  Core supply range of 1.14 V to 1.26 V to match platform power requirements and validate system-level power planning.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard embedded and consumer environments.
• Regulatory Compliance  RoHS compliant materials and assembly to meet common environmental requirements.

Typical Applications

• Programmable logic prototyping  Use the XC3S4000-4FG676C’s 62,208 logic elements and on-chip memory to prototype and validate custom digital designs and state machines on production-like hardware.
• I/O-dense interface control  With 489 I/O pins, the device supports designs that require multiple parallel interfaces, bus bridging, or front-end I/O aggregation.
• Hardware acceleration  Leverage the device’s gate and logic capacity to offload compute-intensive functions into dedicated hardware blocks for improved deterministic performance.

Unique Advantages

• Substantial programmable resources: 62,208 logic elements and approximately 4,000,000 gates enable implementation of sizeable custom logic without immediate need for external ASICs.
• On-chip memory for local data handling: Approximately 1.77 Mbits of embedded RAM reduce dependence on external memory for buffering and temporary storage.
• High I/O count: 489 I/O pins simplify system integration by supporting numerous peripheral connections directly at the FPGA.
• Compact BGA package: The 676-FBGA (27×27) package offers a dense footprint for board-level integration in space-constrained designs.
• RoHS compliant: Materials and assembly meet RoHS requirements to support environmentally conscious product builds.

Why Choose XC3S4000-4FG676C?

The XC3S4000-4FG676C positions itself as a capable, commercial-grade FPGA option for designers who need a balance of logic density, embedded memory, and extensive I/O in a compact surface-mount package. Its specified voltage range and operating temperature make it straightforward to integrate into standard embedded systems and digital designs.

This part is well suited for teams building prototypes, mid-complexity hardware accelerators, or I/O-heavy control logic that benefit from on-chip resources and a high pin count. Its RoHS compliance and BGA package support modern manufacturing and assembly workflows while providing the programmability expected from FPGA-based solutions.

Request a quote or submit a purchase inquiry for the XC3S4000-4FG676C to obtain pricing, availability, and lead-time information tailored to your project requirements.