XC3S4000-4FGG676C

The XC3S4000-4FGG676C is a commercial-grade Spartan®-3 field programmable gate array from AMD. It combines high logic density and on-chip memory with a large I/O complement in a 676-BGA package for surface-mount assembly.

With 62,208 logic elements, approximately 1.77 Mbits of embedded memory and up to 489 I/O pins, this device is targeted at commercial FPGA designs that require substantial logic capacity, embedded RAM, and extensive I/O connectivity while operating within a 0 °C to 85 °C range.

Key Features

• Core Logic — 62,208 logic elements and 6,912 configurable logic blocks (CLBs) delivering up to 4,000,000 gates of implementation capacity for complex digital designs.
• Embedded Memory — Approximately 1.77 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for custom logic functions.
• I/O Capacity — 489 user I/O pins to support a wide range of interfaces and peripheral connections in I/O-intensive applications.
• Package and Mounting — 676-ball FBGA (27 × 27) package in a surface-mount form factor for high-density PCB integration.
• Power — Core supply voltage range of 1.14 V to 1.26 V to match system power budgeting and supply rails.
• Operating Range — Commercial operating temperature specified from 0 °C to 85 °C for typical commercial-environment deployments.
• Environmental Compliance — RoHS compliant for alignment with lead-free assembly requirements.

Typical Applications

• Custom Digital Processing — Implement application-specific logic and data processing pipelines using the device’s large logic element count and embedded RAM.
• Protocol Bridging and Interface Conversion — Leverage the high I/O count to connect and translate between multiple peripheral and bus standards.
• System Integration — Consolidate glue logic, timing, and control functions into a single programmable device to reduce component count on commercial products.

Unique Advantages

• High Logic Density: 62,208 logic elements and 4,000,000 gates enable implementation of complex, multi-function designs without external ASICs.
• Substantial On-Chip Memory: Approximately 1.77 Mbits of embedded RAM reduces dependency on external memory for many buffering and caching tasks.
• Extensive I/O: 489 I/O pins accommodate multiple peripherals, parallel buses, and high-pin-count interfaces in a single device.
• Compact BGA Package: 676-FBGA (27 × 27) provides a space-efficient footprint for high-density PCB layouts and surface-mount assembly processes.
• Commercial Temperature Grade: Rated 0 °C to 85 °C to match typical commercial product deployment environments.
• RoHS Compliant: Meets lead-free environmental requirements for modern manufacturing workflows.

Why Choose XC3S4000-4FGG676C?

The XC3S4000-4FGG676C delivers a balanced combination of logic capacity, embedded memory, and a high I/O count in a compact 676-BGA package, making it well suited for commercial FPGA designs that require integration of significant digital functionality. Its specified core voltage range and commercial operating temperature provide predictable behavior within standard commercial systems.

Designed and supplied by AMD, this Spartan®-3 FPGA targets developers and teams building complex programmable logic solutions who need verifiable capacity and I/O without moving to a larger, more costly device family.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S4000-4FGG676C for your next commercial FPGA design.