XC3S4000-4FGG900I

The XC3S4000-4FGG900I is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD in a 900-BBGA package. It delivers a high-density, reconfigurable logic platform featuring 6,912 configurable logic blocks and 62,208 logic elements, suitable for complex digital designs that require substantial on-chip resources and I/O capacity.

Designed for industrial applications, this surface-mount FPGA offers approximately 1.77 Mbits of embedded memory, 633 I/O pins, and a device gate count of 4,000,000. It operates across a 1.14 V to 1.26 V supply range and supports an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic 6,912 configurable logic blocks and 62,208 logic elements provide substantial programmable logic capacity for complex finite state machines, custom datapaths, and glue logic.
• Embedded Memory Approximately 1.77 Mbits of on-chip RAM for buffering, FIFOs, and small lookup tables that support on-chip data storage without external memory for many applications.
• I/O Density 633 I/O pins enable high-connectivity designs, simplifying interfacing to peripherals, sensors, and external devices.
• Gate Count 4,000,000 gates of logic capacity to accommodate large-scale integration of digital functions.
• Package & Mounting 900-BBGA (900-FBGA, 31 × 31) surface-mount package suitable for compact, high-density PCB layouts.
• Power Nominal core supply range of 1.14 V to 1.26 V supports stabilized power domain design and predictable operating margins.
• Temperature & Grade Industrial-grade device rated for −40 °C to 100 °C operation, designed to meet the demands of industrial environments.
• Environmental Compliance RoHS compliant for adherence to common environmental and manufacturing standards.

Typical Applications

• Industrial Control Implement motor control, PLC glue logic, and real-time control functions leveraging industrial operating temperature range and extensive I/O.
• Communications Infrastructure Use the device’s large logic capacity and high I/O count to implement protocol processing, switching logic, and interface bridging.
• Embedded System Prototyping Rapidly prototype complex digital systems that require substantial on-chip logic and memory without immediate external memory dependencies.
• High-Density I/O Interfacing Consolidate multiple peripheral interfaces and sensor inputs through the FPGA’s 633 available I/Os to reduce system BOM and routing complexity.

Unique Advantages

• Substantial Logic Resources: 62,208 logic elements and 6,912 CLBs provide the capacity to integrate multiple functions on a single device, reducing component count.
• Significant On-Chip Memory: Approximately 1.77 Mbits of embedded RAM supports onboard buffering and local data processing to improve system responsiveness.
• High I/O Count: 633 I/Os enable flexible connectivity and simplify board-level design for I/O-heavy applications.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C to meet the environmental demands of industrial deployments.
• Compact, High-Density Package: 900-BBGA (31 × 31) package allows dense PCB layouts while maintaining a high pin count.
• RoHS Compliant: Supports environmentally conscious manufacturing and regulatory compliance requirements.

Why Choose XC3S4000-4FGG900I?

The XC3S4000-4FGG900I combines extensive programmable logic, substantial embedded memory, and a high I/O count in an industrial-grade package, making it well suited for demanding digital designs that require integration and reliability. Its 900-BBGA package and surface-mount mounting type support compact board implementations while preserving signal density.

This FPGA is a practical choice for engineers and procurement teams developing industrial control, communications, or embedded prototyping projects that benefit from on-chip resources, wide operating temperature range, and RoHS compliance. The device’s mix of logic capacity, memory, and I/O provides scalable headroom for evolving system requirements.

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