XC3S4000-5FGG676C

The XC3S4000-5FGG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, delivered in a 676-ball BGA package. It combines a high count of logic elements and on-chip memory with a large number of I/O pins to address complex, high-density digital designs. This commercial-grade, surface-mount device is suited for designs that require substantial programmable logic, embedded memory, and extensive connectivity within a 27 × 27 mm FBGA footprint.

Key Features

• Core Logic  Approximately 62,208 logic elements provide substantial capacity for implementing complex digital functions and custom logic architectures.
• Configurable Logic Blocks  6,912 configurable logic resources support hierarchical and parallel logic structures for flexible design partitioning.
• Embedded Memory  Approximately 1.77 Mbits of on-chip RAM suitable for buffering, FIFOs, and local data storage within the FPGA fabric.
• I/O Density  489 user I/O pins enable broad external connectivity for high-pin-count interfaces and multi-channel systems.
• Gate Capacity  A logic capacity of 4,000,000 gates for implementing feature-rich, gate-intensive designs.
• Power Supply  Requires a core voltage in the range of 1.14 V to 1.26 V, allowing for controlled power-domain design and supply planning.
• Package and Mounting  676-ball FBGA (27 × 27 mm) package in a surface-mount form factor for compact board-level integration.
• Operating Range  Commercial temperature range rated from 0 °C to 85 °C to match standard commercial electronic environments.
• Compliance  RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• High-density I/O systems  Use the device’s 489 I/O pins to implement multi-interface boards, parallel data acquisition, or multi-channel communication endpoints.
• Embedded memory-dependent designs  Leverage approximately 1.77 Mbits of on-chip RAM for buffering, packet storage, and local data manipulation within the FPGA fabric.
• Complex logic and protocol implementation  Deploy the 62,208 logic elements and 4,000,000-gate capacity to implement custom accelerators, protocol bridges, and intensive combinational/sequential logic.

Unique Advantages

• High logic density: 62,208 logic elements provide the headroom needed for sizeable custom logic and parallel processing architectures.
• Significant embedded memory: Approximately 1.77 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-machine needs.
• Extensive I/O connectivity: With 489 I/O pins, the device supports complex multi-interface designs without heavy external multiplexing.
• Compact BGA package: 676-ball FBGA (27 × 27 mm) enables dense PCB layouts while preserving high I/O count and thermal performance for commercial applications.
• Designed for commercial deployments: Surface-mount, commercial-grade construction and RoHS compliance help streamline manufacturing and regulatory alignment.

Why Choose XC3S4000-5FGG676C?

The XC3S4000-5FGG676C positions itself as a robust, commercially graded FPGA option for designs that need a combination of high logic capacity, generous embedded memory, and substantial I/O count in a compact FBGA package. Its specification set — including approximately 62,208 logic elements, 1.77 Mbits of on-chip RAM, 489 I/Os, and a 676-ball FBGA footprint — makes it well suited to developers building dense, feature-rich digital systems that require integrated programmable logic and memory resources.

Manufactured by AMD and delivered as a surface-mount, RoHS-compliant device with a defined core voltage range and commercial temperature rating, the XC3S4000-5FGG676C offers a dependable platform for mid- to high-complexity FPGA designs where integration density and board-level connectivity are priorities.

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