XC3S400A-4FG320I

The XC3S400A-4FG320I is a Spartan®-3A Field Programmable Gate Array (FPGA) from AMD offering a balanced combination of programmable logic, embedded memory, and I/O capacity in a compact 320-BGA package. Its architecture delivers 8,064 logic elements with 896 CLBs and approximately 0.37 Mbits of on-chip RAM, making it suitable for a range of industrial embedded and control applications that require configurable logic and moderate memory resources.

Designed for surface-mount assembly and specified for industrial temperature operation, this device targets applications that need robust, reconfigurable logic with a low-voltage core and a high pin-count interface in a small footprint.

Key Features

• Logic Capacity — 8,064 logic elements implemented across 896 CLBs to support medium-complexity digital designs.
• Embedded Memory — Approximately 0.37 Mbits of on-chip RAM for buffering, state storage, and small look-up tables.
• I/O and System Integration — 251 user I/Os provide flexible external connectivity for peripherals, sensors, and interface bridging.
• Gate Count — 400,000 gates for mapping combinational and sequential logic resources.
• Power — Core supply range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package and Mounting — 320-BGA (320-FBGA, 19×19) surface-mount package for high-density board integration.
• Temperature Range — Industrial-grade operating range from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant to support regulated manufacturing and disposal practices.

Typical Applications

• Industrial Control — Implement custom control logic and state machines, leveraging the device’s logic elements and industrial temperature rating for reliable operation in factory environments.
• Embedded Processing — Offload specialized processing tasks or implement custom peripherals using on-chip logic and embedded RAM for intermediate data storage.
• Interface Bridging — Use abundant I/O pins to bridge disparate interfaces or to implement protocol conversion between sensors and host systems.
• Prototyping and Development — Evaluate and iterate digital designs that require reconfigurable logic and a mid-range resource set in a compact package.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements combined with approximately 0.37 Mbits of RAM deliver a versatile platform for medium-complexity designs.
• High I/O Count: 251 user I/Os enable dense external connectivity, reducing the need for additional interface components.
• Compact, High-Density Packaging: 320-BGA (19×19) package supports space-constrained PCB layouts while maintaining a high pin count.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Low-Voltage Core: Narrow core supply window (1.14 V to 1.26 V) aligns with modern low-voltage system rails.
• RoHS Compliant: Helps meet environmental and regulatory requirements for manufactured products.

Why Choose XC3S400A-4FG320I?

The XC3S400A-4FG320I positions itself as a reliable, mid-range Spartan®-3A FPGA option for designers who need a combination of configurable logic, embedded memory, and a high I/O count in a compact BGA package. Its industrial temperature rating and RoHS compliance make it appropriate for demanding embedded and control applications where environmental robustness and regulatory compliance matter.

This device is well suited to engineering teams building industrial automation, embedded processing, or interface bridging solutions that require scalable, reconfigurable hardware with a solid balance of resources and board-level density.

Request a quote or submit your requirements to receive pricing and availability information for the XC3S400A-4FG320I. Our team can help you evaluate supply options and lead times for your project.