XC3S400A-4FGG320C

The XC3S400A-4FGG320C is a Spartan®-3A field programmable gate array (FPGA) from AMD, implemented in a 320-ball BGA package. It provides a balance of programmable logic, embedded RAM, and I/O capacity for a range of programmable-logic designs that require on-chip resources and flexible interfacing.

With 8,064 logic elements organized across 896 configurable logic blocks, approximately 0.369 Mbits of embedded RAM and 251 user I/O, this device is suited to applications needing moderate logic density, local memory and considerable peripheral connectivity within a compact surface-mount package.

Key Features

• Logic Capacity — 896 configurable logic blocks (CLBs) delivering 8,064 logic elements for implementing custom digital logic and control functions.
• Embedded Memory — Total on-chip RAM of 368,640 bits (approximately 0.369 Mbits) for buffering, FIFOs and small data stores.
• I/O Resources — 251 user I/Os to support a wide range of external interfaces and peripheral connections.
• Gate Equivalent — Device complexity of approximately 400,000 gates for moderate-density digital designs.
• Power — Core supply range from 1.14 V to 1.26 V to match targeted system power architectures.
• Package & Mounting — 320-BGA (320-FBGA, 19×19) surface-mount package for compact PCB integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard temperature environments.
• Environmental Compliance — RoHS compliant to meet common materials and manufacturing requirements.

Typical Applications

• Programmable Logic Implementation — Implement custom digital functions, control logic and finite-state machines using the device's CLBs and logic elements.
• Interface Bridging — Use the 251 I/Os to bridge between multiple peripherals, sensors and external devices.
• On-board Data Buffering — Leverage approximately 0.369 Mbits of embedded RAM for temporary data storage, buffering and small FIFO structures.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements paired with 368,640 bits of RAM provide a practical mix for mid-range programmable tasks without over-provisioning.
• High I/O Count: 251 user I/Os enable broad peripheral connectivity and flexible system interfacing options.
• Compact BGA Package: The 320-BGA (19×19 FBGA) package allows for a small PCB footprint while maintaining signal density.
• Low-Voltage Core: Core supply of 1.14 V to 1.26 V supports modern low-voltage power domains and efficient power budgeting.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation, suitable for standard commercial electronics environments.
• RoHS Compliant: Meets common environmental-materials requirements for compliant manufacturing and supply chains.

Why Choose XC3S400A-4FGG320C?

The XC3S400A-4FGG320C positions itself as a compact, commercially graded FPGA offering a practical combination of logic density, embedded RAM and a high I/O count in a 320-BGA package. It is well suited to designers who need moderate programmable logic capability, local memory for buffering, and numerous I/Os for interfacing within space-constrained PCB layouts.

For teams focused on scalable programmable designs, this device delivers predictable resources—8,064 logic elements, approximately 0.369 Mbits of RAM and 251 I/Os—backed by AMD’s Spartan®-3A product family lineage. Its RoHS compliance and standard commercial temperature range support deployment in mainstream electronics products and development platforms.

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