XC3S400A-4FT256C

The XC3S400A-4FT256C is a Spartan®-3A Field Programmable Gate Array (FPGA) IC from AMD, offering a mid-range logic density in a compact 256-ball L-BGA package. It provides 8064 logic elements, approximately 0.37 Mbits of embedded memory, and up to 195 general-purpose I/O, making it suited for commercial-grade digital designs that require configurable logic, on-chip memory, and substantial I/O connectivity.

Designed for surface-mount assembly and RoHS-compliant production, this device operates from a 1.14 V to 1.26 V core supply and supports an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity 8064 logic elements provide scalable programmable logic resources for implementing custom digital functions and moderate-density designs.
• Embedded Memory Approximately 0.37 Mbits (368,640 bits) of on-chip RAM to store state, buffers, and small data structures within the FPGA fabric.
• I/O Density 195 user I/O pins enable broad connectivity for parallel interfaces, peripheral control, and signal routing in compact designs.
• Gate Equivalent 400,000 gates indicating the device's overall logic complexity and integration capability.
• Power and Supply Core supply range of 1.14 V to 1.26 V to match system power rails and support stable FPGA operation.
• Package and Mounting 256-LBGA package (supplier package: 256-FTBGA, 17×17) designed for surface-mount assembly to minimize board area while providing high pin density.
• Operating Range Commercial-grade temperature range of 0 °C to 85 °C for standard environmental conditions.
• Regulatory RoHS-compliant for environmental and manufacturing conformity.

Typical Applications

• Embedded Logic and Control Implement custom state machines, control logic, and glue functions where moderate logic density and on-chip RAM are required.
• Prototyping and Development Use as a platform for validating digital designs and integration of multiple logic functions before final system integration.
• Interface and I/O Expansion Provide parallel and serial interface bridging or I/O expansion in systems needing additional programmable connectivity.

Unique Advantages

• Balanced Logic and Memory: 8064 logic elements paired with approximately 0.37 Mbits of embedded RAM support a wide range of mid-density designs without external memory for small data needs.
• High I/O Count in Compact Package: 195 I/O pins in a 256-LBGA package allow extensive connectivity while preserving PCB real estate.
• Compact Surface-Mount Form Factor: The 256-FTBGA (17×17) supplier package is optimized for dense board layouts and automated assembly processes.
• Commercial-Grade Operating Range: Rated for 0 °C to 85 °C operation to meet typical commercial product requirements.
• RoHS Compliance: Environmentally compliant for manufacturing and deployment in RoHS-regulated regions.
• Predictable Power Envelope: Defined core supply range (1.14 V–1.26 V) supports clear power budgeting during system design.

Why Choose XC3S400A-4FT256C?

The XC3S400A-4FT256C positions itself as a practical, commercial-grade FPGA option for designs that require a balanced combination of logic density, on-chip memory, and high I/O capacity in a compact surface-mount package. Its 8064 logic elements, approximately 0.37 Mbits of embedded RAM, and 195 I/O make it suitable for developers implementing custom digital functions, interface logic, or prototyping board-level integrations.

With clear electrical and thermal limits—1.14 V to 1.26 V core supply and 0 °C to 85 °C operating range—plus RoHS compliance and a space-efficient 256-LBGA footprint, this device offers a dependable, integration-friendly building block for commercial electronic designs.

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