XC3S400A-4FTG256C

The XC3S400A-4FTG256C is a Spartan®-3A field programmable gate array (FPGA) IC from AMD designed for medium-density programmable logic applications. It provides 8,064 logic elements, approximately 368,640 bits of on-chip RAM, and up to 195 user I/O pins in a 256-LBGA surface-mount package.

This commercial-grade FPGA operates with a core supply range of 1.14 V to 1.26 V, supports designs requiring roughly 400,000 gates of logic, and is RoHS compliant for regulatory alignment.

Key Features

• Logic Capacity  8,064 logic elements enabling medium-density programmable logic implementations and support for designs up to approximately 400,000 gates.
• Embedded Memory  Approximately 0.369 Mbits of on-chip RAM (368,640 bits) for local storage, buffering, and state retention.
• I/O Resources  Up to 195 user I/O pins to support parallel interfaces and multiple external peripherals.
• Power  Core supply voltage range from 1.14 V to 1.26 V to match system power rails and vendor recommendations.
• Package & Mounting  256-LBGA surface-mount package (supplier device package: 256-FTBGA, 17×17) suitable for compact PCB layouts.
• Operating Range  Commercial temperature rating from 0 °C to 85 °C for standard ambient operating environments.
• Regulatory  RoHS compliant to support environmental and materials requirements.

Typical Applications

• Prototyping and development platforms  Use the 8,064 logic elements and 195 I/O to prototype medium-complexity digital designs and evaluate interface requirements.
• Custom peripheral and glue logic  Implement custom control, glue logic, and protocol adapters where on-chip memory and multiple I/O are required.
• I/O-intensive interfaces  Support parallel data paths and multiple peripheral connections using the high I/O count.

Unique Advantages

• Balanced logic and memory  Combines 8,064 logic elements with approximately 0.369 Mbits of embedded RAM to accommodate control and data-path functions on a single device.
• High I/O count  Up to 195 user I/O pins simplify external interfacing and reduce the need for additional I/O expanders.
• Compact surface-mount package  256-LBGA/256-FTBGA packaging enables dense PCB implementations while maintaining accessibility to a high number of signals.
• Low-voltage core  Core supply between 1.14 V and 1.26 V aligns with modern low-voltage system designs.
• Commercial temperature rating  Rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant  Meets lead-free and restricted substance requirements for many global markets.

Why Choose XC3S400A-4FTG256C?

The XC3S400A-4FTG256C delivers a practical combination of logic density, on-chip memory, and high I/O count in a compact 256-LBGA footprint from AMD’s Spartan®-3A family. Its specifications make it well suited for designers who need medium-density programmable logic with substantial interfacing capability while adhering to commercial temperature and RoHS requirements.

This FPGA is appropriate for development teams and OEMs implementing medium-complexity control, data-path, and interface logic where a balance of logic elements, embedded RAM, and I/O count simplifies board-level design and component sourcing.

Request a quote or submit an inquiry to obtain pricing and availability for the XC3S400A-4FTG256C for your next design.