XC3S400A-5FGG400C

The XC3S400A-5FGG400C is a Spartan®-3A FPGA in a 400-ball BGA package designed for commercial-grade applications. It provides a balanced combination of configurable logic, embedded memory, and high I/O density for implementing custom digital functions.

Key device resources include 8,064 logic elements, approximately 0.37 Mbits of embedded memory, support for about 400,000 gates and 311 I/O pins, all within a 400-FBGA (21×21) surface-mount package. The device operates from a 1.14 V to 1.26 V core supply and across a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity 8,064 logic elements provide flexible programmable resources for implementing custom digital logic and moderate-complexity functions.
• On‑chip Memory Approximately 0.37 Mbits of embedded RAM for buffering, state storage, and small lookup tables.
• I/O and Gate Count 311 user I/O pins and support for roughly 400,000 gates to simplify system integration and interface variety.
• Package and Mounting 400-BGA (supplier package: 400-FBGA, 21×21) surface-mount package for compact board-level integration.
• Power Core voltage range of 1.14 V to 1.26 V to match low-voltage power domains.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial electronic products.
• RoHS Compliant Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic and interface functions in commercial electronic products requiring moderate logic density and on-chip memory.
• Prototyping and Development — Use the device’s programmable fabric and abundant I/O for hardware validation and proof-of-concept designs.
• Interface Bridging — Consolidate multiple digital interfaces and bridging logic using the device’s high I/O count and configurable resources.

Unique Advantages

• Well-Balanced Resource Set: Combines 8,064 logic elements, approximately 0.37 Mbits of RAM and 311 I/Os to address a wide range of commercial design requirements without excessive board-level peripherals.
• Compact BGA Packaging: 400-BGA (400-FBGA, 21×21) enables a high-density implementation that saves board area while providing many I/O connections.
• Low-Voltage Core: Narrow core supply range (1.14–1.26 V) aligns with modern low-voltage power domains for efficient power delivery design.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for deployment in typical commercial environments.
• Regulatory Compliance: RoHS compliance supports environmental and regulatory requirements for commercial products.

Why Choose XC3S400A-5FGG400C?

The XC3S400A-5FGG400C delivers a compact, commercially rated FPGA solution that balances logic capacity, embedded memory and high I/O count in a 400-BGA package. Its combination of approximately 8,064 logic elements, on-chip RAM, and roughly 400,000 gates makes it well suited for commercial designs that require programmable logic and flexible interfacing without large form-factor tradeoffs.

This device is a practical choice for engineers designing commercial embedded systems, prototypes, and interface consolidation solutions that need a reliable, RoHS-compliant FPGA with defined operating voltage and temperature specifications.

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