XC3S400A-5FGG320C

The XC3S400A-5FGG320C is a Spartan®-3A field-programmable gate array (FPGA) in a 320-ball BGA package manufactured by AMD. It provides a mid-range programmable logic solution with 8,064 logic elements, approximately 0.369 Mbits of embedded memory, and 251 user I/O pins for compact, flexible digital designs.

Designed for commercial-temperature applications, this surface-mount FPGA combines a significant logic gate count with on-chip memory and a high I/O count to support custom logic, interface bridging, and system integration on space-conscious PCBs.

Key Features

• Core Logic  Contains 8,064 logic elements enabling implementation of moderate-complexity digital designs and custom logic functions.
• Configurable Logic Blocks  Includes 896 configurable logic blocks (CLBs) to structure programmable logic resources across the device.
• Embedded Memory  Provides approximately 0.369 Mbits (368,640 bits) of on-chip RAM for data buffering, state storage, and small lookup tables.
• I/O Capacity  Offers 251 user I/O pins to support multiple external interfaces and parallel connections to peripherals and sensors.
• Logic Density  Equivalent to around 400,000 gates of logic capacity for implementing glue logic, protocol handling, and custom accelerators.
• Package & Mounting  Supplied in a 320-BGA package (320-FBGA, 19×19) with surface-mount mounting suitable for compact PCB layouts.
• Power  Operates from a core voltage supply in the range of 1.14 V to 1.26 V.
• Operating Range  Commercial-grade operating temperature from 0 °C to 85 °C, suitable for standard consumer and industrial indoor environments.
• Environmental Compliance  RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• Prototyping & Development  Use the 8,064 logic elements and on-chip RAM to prototype custom digital logic and validate hardware architectures before production.
• Interface Bridging  Leverage 251 I/O pins to implement protocol translation, bus bridging, or custom peripheral interfaces on a single device.
• Embedded Control  Deploy as a control and glue-logic element in embedded systems where moderate logic density and compact packaging are required.
• Compact Board Designs  The 320-BGA surface-mount package supports high-density PCB layouts for space-constrained applications.

Unique Advantages

• Balanced Logic and Memory  A combination of 8,064 logic elements and approximately 0.369 Mbits of embedded RAM supports a wide range of mid-complexity designs without external memory.
• High I/O Count  With 251 user I/Os, the device accommodates multiple parallel interfaces and external peripherals, reducing the need for additional interface ICs.
• Compact BGA Package  The 320-BGA (19×19) package enables dense board placement and efficient use of PCB real estate.
• Commercial Temperature Rating  Rated for 0 °C to 85 °C operation, making it suitable for typical commercial and indoor industrial applications.
• RoHS Compliant  Meets lead-free manufacturing requirements for environmentally conscious production processes.
• Vendor-backed Manufacturing  Manufactured by AMD, providing traceable sourcing and product consistency from a established semiconductor supplier.

Why Choose XC3S400A-5FGG320C?

The XC3S400A-5FGG320C positions itself as a practical, mid-range FPGA choice for designers requiring a balance of logic capacity, on-chip memory, and a high I/O count in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream embedded, interface, and prototyping applications where board space and integration are priorities.

Backed by AMD manufacturing, this Spartan®-3A device supports designs that need reliable programmable logic resources with modest power and footprint constraints. It is well suited for engineers and procurement teams seeking a verified FPGA building block for development and production in commercial environments.

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