XC3S400A-4FTG256I

The XC3S400A-4FTG256I is a Spartan®-3A field programmable gate array (FPGA) from AMD, offered in a 256-LBGA package. It delivers 896 CLBs and 8,064 logic elements along with approximately 0.37 Mbits of embedded memory, making it suitable for industrial embedded logic and I/O-intensive applications that require configurable hardware resources.

Available in an industrial temperature grade with a compact 256-FTBGA (17×17) supplier package and RoHS compliance, this device provides a balance of integration, I/O count, and on-chip memory for designs operating from −40°C to 100°C and a core supply range of 1.14 V to 1.26 V.

Key Features

• Logic Resources  896 configurable logic blocks (CLBs) and 8,064 logic elements provide a structured fabric for implementing combinational and sequential logic.
• Embedded Memory  Approximately 0.37 Mbits of on-chip RAM supports buffering, FIFOs, and small lookup tables within the FPGA fabric.
• I/O Capacity  195 I/O pins enable connectivity to a wide range of external peripherals and interfaces, suitable for multi-channel designs.
• Gate Count  400,000 gates of programmable logic for consolidating discrete logic and glue functions into a single device.
• Power and Supply  Core voltage operating range from 1.14 V to 1.26 V to match system power-rail requirements.
• Package and Mounting  256-LBGA package (supplier package: 256-FTBGA, 17×17) with surface-mount mounting for compact board integration.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C for designs requiring extended temperature range.
• Regulatory Compliance  RoHS compliant for environmentally conscious designs and supply-chain compatibility.

Unique Advantages

• Balanced Logic and Memory: Combines 8,064 logic elements with approximately 0.37 Mbits of embedded memory to implement control, signal processing, and buffering functions on a single device.
• High I/O Count: 195 I/Os provide flexibility for interfacing multiple peripherals, sensors, or parallel data streams without external I/O expanders.
• Industrial Reliability: Industrial temperature rating (−40°C to 100°C) supports deployments in harsher environments and temperature-variable applications.
• Compact Board Footprint: 256-LBGA / 256-FTBGA (17×17) packaging enables dense board layouts and surface-mount assembly in space-constrained designs.
• Power-Efficient Core Range: Narrow core supply range (1.14 V to 1.26 V) helps align power delivery and reduces complexity in multi-rail systems.
• RoHS Compliance: Environmentally compliant manufacturing supports regulatory and corporate sustainability requirements.

Why Choose XC3S400A-4FTG256I?

The XC3S400A-4FTG256I positions itself as a reliable, industrial-grade Spartan®-3A FPGA that balances logic capacity, on-chip memory, and I/O density in a compact LBGA package. Its combination of 896 CLBs, 8,064 logic elements, 195 I/Os, and approximately 0.37 Mbits of embedded RAM makes it well suited for engineers consolidating control logic, interface glue, and small data buffers into a single programmable device.

This device is appropriate for teams and projects seeking a scalable, manufacturable FPGA solution with defined thermal and power characteristics, RoHS compliance, and a compact surface-mount package for streamlined PCB integration and production.

Request a quote or submit a pricing inquiry to obtain availability, lead times, and ordering information for the XC3S400A-4FTG256I.