XC3S400A-5FTG256C

The XC3S400A-5FTG256C is a Spartan®-3A field programmable gate array offered in a 256-LBGA package. This commercial-grade FPGA provides a balanced combination of logic capacity, on-chip memory and I/O resources for embedded and general-purpose digital designs.

With 8,064 logic elements, approximately 0.37 Mbits of embedded memory, and 195 I/O pins, the device is suited to designs that require moderate gate density, flexible interfacing and surface-mount packaging. It operates from a 1.14 V to 1.26 V supply range and supports commercial operating temperatures from 0 °C to 85 °C.

Key Features

• Core Logic 8,064 logic elements (cells) and an estimated 400,000 gates provide the programmable fabric for implementing control, data-path and glue logic.
• Embedded Memory Approximately 368,640 bits (≈0.37 Mbits) of on-chip RAM to support buffers, FIFOs and small data stores directly in the FPGA fabric.
• I/O Resources 195 general-purpose I/O pins to support multiple peripheral interfaces and parallel connections to external devices.
• Power and Voltage Designed to operate from a core supply voltage range of 1.14 V to 1.26 V for compatibility with common FPGA power rails.
• Package and Mounting 256-LBGA package (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Temperature and Grade Commercial-grade device rated for operation from 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Embedded Control and Glue Logic Use the programmable fabric and 8,064 logic elements to integrate custom control functions and interface logic into compact systems.
• Peripheral and Interface Bridging Leverage 195 I/O pins to connect multiple peripherals and sensors, enabling protocol translation or signal aggregation on a single device.
• On-board Data Buffering Employ the approximately 0.37 Mbits of embedded RAM for temporary storage, FIFO buffering and small data caches within system designs.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements combined with on-chip RAM provide a mix of resources suitable for moderate-complexity designs without external memory dependence.
• Generous I/O Count: 195 I/O pins enable flexible peripheral connectivity, reducing the need for additional interface components on the PCB.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) allows dense board integration while supporting surface-mount assembly processes.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to meet requirements of general-purpose commercial products and environments.
• RoHS Compliant: Conforms to RoHS requirements for materials, simplifying regulatory considerations for commercial products.

Why Choose XC3S400A-5FTG256C?

The XC3S400A-5FTG256C positions itself as a versatile, commercial-grade FPGA option for designers requiring a balanced combination of logic, embedded memory and I/O in a compact surface-mount package. Its specifications make it appropriate for projects that need moderate gate capacity, on-chip buffering and extensive interfacing without moving to larger or higher-density device families.

This part is well suited to engineering teams working on consumer and embedded applications who need a programmable, RoHS-compliant device with predictable operating voltages and temperature range. The device’s package and pin count help simplify board-level integration while keeping BOM complexity manageable.

Request a quote for the XC3S400A-5FTG256C or submit a procurement inquiry to receive pricing and availability information for your next design.