XC3S400AN-4FGG400I

The XC3S400AN-4FGG400I is a Spartan®-3AN field programmable gate array (FPGA) in a 400‑ball BGA package designed for industrial-grade applications. It provides a balanced mix of logic capacity, embedded memory and I/O connectivity for implementing custom digital logic and system glue functions.

Key device characteristics include 896 CLBs, 8,064 logic elements, approximately 0.37 Mbits of embedded memory and up to 311 user I/O pins, combined with a compact 400‑FBGA (21×21) package and an industrial operating temperature range.

Key Features

• Programmable Logic — 896 CLBs and 8,064 logic elements provide capacity for custom combinational and sequential logic implementations.
• Embedded Memory — Approximately 0.37 Mbits of on‑chip RAM for buffering, FIFOs or small data structures within user logic.
• I/O Density — Up to 311 user I/O pins to interface with peripherals, sensors and system buses.
• Logic Scale — Device listing includes 400,000 gates, enabling mid‑range logic designs and fabric complexity.
• Power Supply — Core voltage operating range from 1.14 V to 1.26 V to match system power constraints.
• Package and Mounting — 400‑FBGA (21×21) package in a surface‑mount form factor for compact board layouts.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to support industrial environments.
• RoHS Compliant — Meets lead‑free and restricted substance compliance requirements.

Typical Applications

• Industrial Control — Use the industrial temperature rating and abundant I/O to implement machine control logic and field interfacing.
• Custom Interface and Glue Logic — Mid‑range logic capacity and numerous I/O enable protocol conversion, bus bridging and system glue functions.
• Embedded System Prototyping — Logic elements and on‑chip RAM provide resources for prototyping and validating custom digital blocks.
• Communications and I/O Aggregation — High I/O count supports aggregating and preprocessing signals from multiple peripherals or sensors.

Unique Advantages

• Balanced Logic and Memory: 8,064 logic elements and approximately 0.37 Mbits of embedded memory give designers flexibility to implement both control logic and local data storage.
• High I/O Capacity: 311 user I/Os facilitate direct interfacing to a wide range of external devices without extensive external buffering.
• Industrial Reliability: −40 °C to 100 °C operating range supports deployment in demanding environments.
• Compact, Surface‑Mount Package: 400‑FBGA (21×21) provides a space‑efficient footprint for high‑density PCB designs.
• RoHS Compliance: Meets environmental regulation requirements for lead‑free manufacturing and assembly.

Why Choose XC3S400AN-4FGG400I?

The XC3S400AN-4FGG400I positions itself as a mid‑range, industrial‑grade FPGA that combines a practical balance of logic elements, embedded memory and extensive I/O in a compact 400‑ball BGA package. Its defined supply voltage window and wide operating temperature range make it suitable for designs that require deterministic hardware customization under industrial conditions.

This device is well suited to engineers and teams building custom control logic, interface bridging, or I/O‑dense subsystems who need predictable device specifications, a compact package, and compliance with RoHS requirements.

Request a quote or submit an inquiry today to receive pricing and availability for the XC3S400AN-4FGG400I.