XC3S400AN-4FT256I

The XC3S400AN-4FT256I is a Spartan®-3AN field programmable gate array (FPGA) manufactured by AMD. It provides a programmable logic fabric with 8,064 logic elements, approximately 0.37 Mbits of embedded memory, and up to 195 I/O pins in a compact 256-LBGA package.

This surface-mount, industrial-grade FPGA operates from a 1.14 V to 1.26 V core supply and supports an operating temperature range of −40 °C to 100 °C, making it appropriate for designs that require configurable logic, moderate on-chip RAM, and a high I/O count in temperature-critical environments.

Key Features

• Configurable Logic: 8,064 logic elements provide flexible programmable logic capacity for implementing custom digital functions and control logic.
• Embedded Memory: Approximately 0.37 Mbits of on-chip RAM for data buffering, small packet storage, and state machines.
• I/O and Gate Density: 195 user I/O pins and an equivalent of 400,000 gates to support multiple external interfaces and parallel connectivity.
• Power: Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package and Mounting: 256-LBGA (supplier package 256-FTBGA, 17×17) in a surface-mount format for compact board integration.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation for use in temperature-demanding environments.
• Regulatory Compliance: RoHS compliant to meet common environmental directives.

Typical Applications

• Industrial Control: Implement custom control logic, sequencing, and interface functions where industrial temperature tolerance is required.
• Embedded Logic and Glue: Serve as a programmable glue logic device or embedded controller for coordinating system peripherals and custom state machines.
• I/O Expansion and Interface Bridging: Aggregate and translate between multiple parallel and serial interfaces using the high I/O count and on-chip memory for buffering.

Unique Advantages

• Balanced Logic and Memory: Combines 8,064 logic elements with approximately 0.37 Mbits of embedded RAM to implement compact, integrated digital subsystems without external SRAM for moderate buffering needs.
• High I/O Capacity: 195 I/O pins enable direct connection to multiple peripherals, sensors, and bus interfaces, reducing the need for external multiplexers.
• Industrial Robustness: Specified for −40 °C to 100 °C operation and offered in a surface-mount 256-LBGA package suited to space-constrained PCBs in harsh environments.
• Power-Friendly Core: Narrow core supply window (1.14 V to 1.26 V) that integrates into low-voltage system power architectures.
• Regulatory Readiness: RoHS compliance supports environmental and regulatory requirements for many industrial products.

Why Choose XC3S400AN-4FT256I?

The XC3S400AN-4FT256I positions itself as a practical, industrial-grade FPGA option when moderate programmable logic, on-chip memory, and a high count of I/O are required within a compact BGA footprint. Its combination of 8,064 logic elements, approximately 0.37 Mbits of embedded RAM, and 195 I/O pins supports a wide range of configurable digital tasks while meeting industrial temperature demands.

This device is suited for engineers and procurement teams seeking a reliable, RoHS-compliant FPGA from AMD for industrial or temperature-sensitive electronic designs that benefit from integrated logic, memory, and extensive I/O in a surface-mount package.

Request a quote or submit an inquiry to get pricing and availability for the XC3S400AN-4FT256I. Our team can provide lead-time information and help match this FPGA to your design requirements.