XC3S400AN-4FTG256C

The XC3S400AN-4FTG256C is a Spartan®-3AN field programmable gate array (FPGA) from AMD, supplied in a 256‑LBGA package. It provides a blend of programmable logic capacity, embedded memory, and a high I/O count targeted at commercial embedded and system-level designs.

Designed for applications that require moderate logic density and on-chip memory in a compact surface-mount package, this device supports a supply voltage range of 1.14 V to 1.26 V and operates across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 8064 logic elements enabling implementation of custom digital logic and control functions.
• Embedded Memory — Approximately 0.37 Mbits of on-chip RAM (368,640 total RAM bits) for buffering, FIFOs, and small data stores.
• I/O Resources — 195 user I/Os to support multiple interfaces and peripheral connections without extensive external logic.
• Gate Equivalent — 400,000 gates for measuring overall device scale and integration potential.
• Package & Mounting — 256‑LBGA surface-mount package (supplier device package: 256‑FTBGA, 17×17) for compact board-level integration.
• Power — Specified operating supply voltage from 1.14 V to 1.26 V for core power planning.
• Operating Temperature — Commercial temperature range of 0 °C to 85 °C for typical commercial deployments.
• Compliance — RoHS compliant material designation for regulatory and manufacturing alignment.

Typical Applications

• Embedded control and I/O aggregation — Use the 195 I/Os to consolidate sensors, actuators, and peripheral interfaces onto a single programmable device.
• Interface bridging and glue logic — Leverage 8064 logic elements to implement protocol translation, bus interfacing, and custom glue logic between subsystems.
• Data buffering and small storage — Utilize approximately 0.37 Mbits of embedded memory for FIFO queues, temporary buffering, and small lookup tables.
• Compact system modules — The 256‑LBGA (17×17 FTBGA) package supports space-constrained board designs requiring surface-mount integration.

Unique Advantages

• High functional density: 8064 logic elements provide room for complex combinational and sequential logic without external CPLDs.
• On-chip memory availability: Approximately 0.37 Mbits of RAM reduces dependence on external memory for buffering and small data storage.
• Extensive I/O: 195 I/Os accommodate multiple peripherals and interfaces, simplifying board-level routing and component count.
• Compact surface-mount package: 256‑LBGA (256‑FTBGA, 17×17) enables a small board footprint while maintaining thermal and routing considerations typical of BGA parts.
• Defined power envelope: Narrow core supply range (1.14 V to 1.26 V) aids in predictable power-supply design and planning.
• RoHS compliant: Material compliance supports lead-free manufacturing flows and regulatory requirements.

Why Choose XC3S400AN-4FTG256C?

The XC3S400AN-4FTG256C offers a balanced combination of programmable logic, embedded memory, and I/O capacity in a compact 256‑LBGA surface-mount package. Its feature set is well suited to commercial embedded designs that require on-chip buffering, moderate logic implementation, and a high number of I/Os without expanding the board-level component count.

This device is appropriate for teams and projects that need predictable supply and temperature characteristics, RoHS compliance, and the integration capabilities that come with an FPGA-based approach to system design.

Request a quote or submit a purchase inquiry to check pricing and availability for the XC3S400AN-4FTG256C. Our team can provide lead-time and ordering information to support your design schedule.