XC3S50-4CPG132C

The XC3S50-4CPG132C is a Spartan®-3 Field Programmable Gate Array (FPGA) IC manufactured by AMD. It offers a commercial-grade FPGA fabric with 1,728 logic elements and 192 CLBs, providing moderate programmable logic capacity for commercial embedded designs.

Key on-chip resources include approximately 73,728 bits of embedded RAM and 89 general-purpose I/Os, delivered in a 132-TFBGA (132-CSPBGA 8×8) surface-mount package. The device operates over a supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  1,728 logic elements and 192 CLBs enable moderate-density programmable logic implementations suitable for consolidating control and glue logic.
• On-Chip Memory  Approximately 73,728 bits (≈0.074 Mbits) of embedded RAM support small FIFOs, buffering and state storage within the FPGA fabric.
• I/O Resources  89 general-purpose I/Os provide flexible connectivity for peripherals, interfaces and custom I/O routing.
• Logic Capacity  Approximately 50,000 gates of logic make this device suitable for a range of mid-range logic functions and finite-state implementations.
• Power  Operates from a defined core voltage supply range of 1.14 V to 1.26 V to match system power budgets.
• Package and Mounting  Available in a 132-TFBGA / 132-CSPBGA (8×8) surface-mount package for compact PCB integration.
• Temperature and Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, supporting regulatory and assembly requirements.

Typical Applications

• Commercial Embedded Systems  Provides 1,728 logic elements and 89 I/Os for implementing control logic, protocol bridging and peripheral interfacing in commercial equipment.
• Low- to Mid-Density Logic Integration  With approximately 50,000 gates and 192 CLBs, the device is suited to consolidate moderate amounts of discrete logic into a single FPGA.
• Memory-Buffered Functions  Approximately 73,728 bits of embedded RAM enable on-chip buffering, small FIFOs and temporary data storage for streaming or control tasks.

Unique Advantages

• Balanced Logic and Memory Mix:  Combines 1,728 logic elements with roughly 73,728 bits of embedded RAM to support mixed logic and small-data buffering needs.
• Ample I/O Count:  89 I/Os allow flexible interfacing to external peripherals and custom I/O routing without immediate need for external GPIO expanders.
• Compact Surface-Mount Package:  132-TFBGA (132-CSPBGA 8×8) package simplifies PCB layout for space-constrained commercial designs.
• Defined Power Envelope:  Operates within a narrow core voltage range (1.14 V–1.26 V) to align with precise power-supply designs.
• Commercial Temperature Grade:  Rated for 0 °C to 85 °C, suitable for typical commercial operating environments.
• Regulatory Compliance:  RoHS compliant to meet common environmental regulations for electronic assemblies.

Why Choose XC3S50-4CPG132C?

The XC3S50-4CPG132C positions itself as a commercial-grade Spartan-3 FPGA option that balances moderate programmable logic capacity, on-chip memory and a high I/O count in a compact 132-TFBGA surface-mount package. Its defined supply voltage range and commercial temperature rating make it appropriate for mainstream embedded designs requiring integrated logic, buffering and peripheral interfacing.

This device is well suited to engineers and procurement teams seeking a cost-effective FPGA solution for consolidating mid-range logic functions, implementing protocol bridges or adding custom control logic while maintaining RoHS compliance and compact board footprints.

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