XC3S50-4PQ208I

The XC3S50-4PQ208I is a Spartan®-3 field programmable gate array (FPGA) from AMD designed for mid-density digital logic integration. It provides 192 configurable logic blocks delivering 1,728 logic elements, approximately 0.074 Mbits of embedded memory, and 124 user I/O pins in a 208-BFQFP package.

Built for industrial applications, this surface-mount FPGA supports an operating voltage range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, offering a balance of integration, I/O count, and on-chip memory for compact system designs.

Key Features

• Core Logic  192 configurable logic blocks (CLBs) providing 1,728 logic elements to implement combinational and sequential logic functions.
• Embedded Memory  Total on-chip RAM of 73,728 bits (approximately 0.074 Mbits) for small data buffering, state storage, and lookup tables.
• I/O Capacity  124 user I/O pins to interface with external peripherals, sensors, and buses while maintaining a compact PCB footprint.
• Device Scale  Approximately 50,000 gates of logic capacity, enabling moderate-complexity digital designs within a single FPGA device.
• Power  Core supply range of 1.14 V to 1.26 V to match system power rails and enable predictable power budgeting.
• Package & Mounting  208-BFQFP package (supplier device package listed as 208-PQFP (28x28)) with surface-mount mounting for automated assembly.
• Temperature & Grade  Industrial-grade device rated for −40 °C to 100 °C operation, suitable for demanding ambient conditions.
• Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.

Unique Advantages

• Balanced Logic and Memory: The combination of 1,728 logic elements and 73,728 bits of on-chip RAM supports control logic, small buffers, and lookup tables without requiring external memory for many designs.
• Generous I/O Count: With 124 user I/Os, the device simplifies board-level interfacing and reduces the need for additional interface components.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, enabling deployment in environments that demand wider temperature tolerance.
• Compact Packaging: The 208-BFQFP/208-PQFP (28x28) package provides a surface-mount form factor that fits space-constrained PCBs while supporting automated assembly.
• Predictable Power Envelope: A defined supply range of 1.14 V to 1.26 V helps designers plan power distribution and thermal management.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and simplifies regulatory considerations.

Why Choose XC3S50-4PQ208I?

The XC3S50-4PQ208I delivers a practical combination of logic density, embedded memory, and a high I/O count in an industrial-grade, surface-mount package. Its 1,728 logic elements and approximately 73,728 bits of on-chip RAM make it suitable for compact systems that require moderate digital integration without resorting to larger, more complex FPGAs.

Manufactured by AMD and offered in a 208-BFQFP package, this FPGA is aimed at engineers and procurement teams seeking a reliable, RoHS-compliant device with well-defined electrical and thermal operating ranges for production designs.

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