XC3S50-4PQG208C

IC FPGA 124 I/O 208QFP
Part Description

Spartan®-3 Field Programmable Gate Array (FPGA) IC 124 73728 1728 208-BFQFP

Quantity 149 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O124Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs192Number of Logic Elements/Cells1728
Number of Gates50000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of XC3S50-4PQG208C – Spartan®-3 FPGA 208-BFQFP

The XC3S50-4PQG208C is a Spartan®-3 Field Programmable Gate Array (FPGA) in a 208-BFQFP package. It provides a compact, reconfigurable logic resource with on-chip memory and flexible I/O for a range of commercial programmable-logic applications.

Key Features

  • Core Logic 1728 logic elements and 192 configurable logic blocks (CLBs) provide the core programmable fabric for implementing custom digital logic.
  • Embedded Memory Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, small lookup tables, and state storage.
  • I/O 124 user I/O pins to support peripheral interfaces and board-level signal connectivity.
  • Gate Count 50,000 gates indicative of the device's overall integration level for glue logic and mid-density applications.
  • Power Core supply range of 1.14 V to 1.26 V to match required core voltage rails.
  • Package & Mounting 208-BFQFP (supplier package 208-PQFP, 28×28 mm) in a surface-mount form factor for compact PCB layouts.
  • Operating Range Commercial temperature rating from 0 °C to 85 °C suitable for general-purpose environments.
  • Environmental Compliance RoHS compliant to support lead-free manufacturing requirements.

Typical Applications

  • Custom Logic Implementation Implement glue logic, protocol translators, and finite-state machines where field-programmable logic is required.
  • Interface Bridging Use available I/O to bridge and adapt signals between different peripherals and subsystems on a PCB.
  • Prototyping and Development Deploy as a mid-density FPGA for design validation and early hardware bring-up.

Unique Advantages

  • Balanced Integration: Combines 1728 logic elements with on-chip RAM and 124 I/O to address a variety of mid-density design needs without excess board-level components.
  • Compact Surface-Mount Package: The 208-BFQFP package supports space-efficient board layouts while maintaining ample I/O connectivity.
  • Low-Voltage Core: Narrow core supply range (1.14 V to 1.26 V) simplifies power-supply design for the FPGA core.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial applications where moderate operating range is acceptable.
  • RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally responsible production.

Why Choose XC3S50-4PQG208C?

The XC3S50-4PQG208C positions as a mid-density, commercial-grade FPGA offering a practical mix of logic, memory, and I/O in a compact 208-BFQFP footprint. It is well suited to designs that require configurable digital logic, moderate on-chip storage, and flexible interfacing without moving to higher-density FPGA families.

Designers and procurement teams benefit from a device that delivers integration and predictable supply/temperature characteristics, making it appropriate for prototypes, consumer electronics, and general-purpose embedded applications where commercial-grade components are specified.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC3S50-4PQG208C.

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