XC3S50-4PQG208C
| Part Description |
Spartan®-3 Field Programmable Gate Array (FPGA) IC 124 73728 1728 208-BFQFP |
|---|---|
| Quantity | 149 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 124 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 192 | Number of Logic Elements/Cells | 1728 | ||
| Number of Gates | 50000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 73728 |
Overview of XC3S50-4PQG208C – Spartan®-3 FPGA 208-BFQFP
The XC3S50-4PQG208C is a Spartan®-3 Field Programmable Gate Array (FPGA) in a 208-BFQFP package. It provides a compact, reconfigurable logic resource with on-chip memory and flexible I/O for a range of commercial programmable-logic applications.
Key Features
- Core Logic 1728 logic elements and 192 configurable logic blocks (CLBs) provide the core programmable fabric for implementing custom digital logic.
- Embedded Memory Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, small lookup tables, and state storage.
- I/O 124 user I/O pins to support peripheral interfaces and board-level signal connectivity.
- Gate Count 50,000 gates indicative of the device's overall integration level for glue logic and mid-density applications.
- Power Core supply range of 1.14 V to 1.26 V to match required core voltage rails.
- Package & Mounting 208-BFQFP (supplier package 208-PQFP, 28×28 mm) in a surface-mount form factor for compact PCB layouts.
- Operating Range Commercial temperature rating from 0 °C to 85 °C suitable for general-purpose environments.
- Environmental Compliance RoHS compliant to support lead-free manufacturing requirements.
Typical Applications
- Custom Logic Implementation Implement glue logic, protocol translators, and finite-state machines where field-programmable logic is required.
- Interface Bridging Use available I/O to bridge and adapt signals between different peripherals and subsystems on a PCB.
- Prototyping and Development Deploy as a mid-density FPGA for design validation and early hardware bring-up.
Unique Advantages
- Balanced Integration: Combines 1728 logic elements with on-chip RAM and 124 I/O to address a variety of mid-density design needs without excess board-level components.
- Compact Surface-Mount Package: The 208-BFQFP package supports space-efficient board layouts while maintaining ample I/O connectivity.
- Low-Voltage Core: Narrow core supply range (1.14 V to 1.26 V) simplifies power-supply design for the FPGA core.
- Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial applications where moderate operating range is acceptable.
- RoHS Compliant: Conforms to lead-free manufacturing requirements for environmentally responsible production.
Why Choose XC3S50-4PQG208C?
The XC3S50-4PQG208C positions as a mid-density, commercial-grade FPGA offering a practical mix of logic, memory, and I/O in a compact 208-BFQFP footprint. It is well suited to designs that require configurable digital logic, moderate on-chip storage, and flexible interfacing without moving to higher-density FPGA families.
Designers and procurement teams benefit from a device that delivers integration and predictable supply/temperature characteristics, making it appropriate for prototypes, consumer electronics, and general-purpose embedded applications where commercial-grade components are specified.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC3S50-4PQG208C.

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