XC3S50-4PQ208C

The XC3S50-4PQ208C is a Spartan®-3 Field Programmable Gate Array (FPGA) offered in a 208‑BFQFP package. It provides a moderate logic capacity with 1,728 logic elements, approximately 0.074 Mbits of embedded memory, and up to 124 user I/O pins for flexible interface integration.

Designed for commercial-temperature applications, this surface-mount FPGA operates from a core supply of 1.14 V to 1.26 V and targets mid-density programmable logic requirements where a compact package and predictable electrical characteristics are important.

Key Features

• Core FPGA Spartan®-3 architecture in a 208‑BFQFP package providing programmable logic resources for custom digital designs.
• Logic Density 1,728 logic elements (cells) supporting designs up to the device’s 50,000-gate equivalent capacity.
• Embedded Memory Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, small data stores, and state machines.
• I/O Count 124 user I/O pins to support a variety of peripheral interfaces and external device connections.
• Power Core supply range of 1.14 V to 1.26 V to define the device’s power domain and enable compatible power-rail planning.
• Package & Mounting Supplied in a 208‑BFQFP surface-mount package; supplier device package listed as 208‑PQFP (28×28) for PCB footprint reference.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental consistency.

Typical Applications

• Embedded logic implementations Mid-density programmable designs that require up to 1,728 logic elements and on-chip RAM for control and data handling.
• Interface consolidation Designs that need up to 124 I/O pins to aggregate and bridge multiple peripheral signals within a compact package.
• Firmware-configurable functions Systems that benefit from field-programmable logic to implement customizable state machines, glue logic, or protocol adaptation.

Unique Advantages

• Moderate logic capacity: 1,728 logic elements and a 50,000-gate equivalent enable a range of mid-sized designs without excessive board real estate.
• On-chip RAM available: Approximately 73,728 bits of embedded memory supports buffering and small data structures directly in the FPGA fabric.
• High I/O availability: 124 user I/Os provide flexibility for multi-interface designs and external device connectivity.
• Compact, surface-mount package: 208‑BFQFP (supplier 208‑PQFP 28×28) supports dense PCB layouts and automated assembly processes.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation for typical commercial applications.
• RoHS compliant: Environmentally compliant manufacturing and assembly compatibility.

Why Choose XC3S50-4PQ208C?

The XC3S50-4PQ208C positions itself as a practical, commercial-grade Spartan®-3 FPGA option for engineers needing a balance of logic resources, embedded memory, and I/O capacity in a compact surface-mount package. Its defined supply voltage range and temperature rating make it straightforward to integrate into systems with predictable power and thermal budgets.

This device suits teams building mid-density programmable solutions that prioritize integration and reconfigurability—offering a clear upgrade path within FPGA-based designs and providing reliable performance for applications that fit within its logic, memory, and I/O envelope.

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