XC3S400AN-5FGG400C

IC FPGA 311 I/O 400FBGA
Part Description

Spartan®-3AN Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA

Quantity 1,406 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package400-FBGA (21x21)GradeCommercialOperating Temperature0°C – 85°C
Package / Case400-BGANumber of I/O311Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs896Number of Logic Elements/Cells8064
Number of Gates400000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits368640

Overview of XC3S400AN-5FGG400C – Spartan®-3AN FPGA, 8,064 logic elements, 400-BGA

The XC3S400AN-5FGG400C is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC from AMD in a 400-BGA package. It delivers a combination of programmable logic, embedded memory, and a high I/O count for commercial-grade FPGA applications.

With 896 configurable logic blocks (CLBs) totaling 8,064 logic elements and approximately 0.37 Mbits of on-chip RAM, this device is targeted at commercial designs that require configurable digital logic in a compact surface-mount 400-FBGA (21×21) package.

Key Features

  • Core Logic  896 configurable logic blocks (CLBs) providing 8,064 logic elements for implementing custom digital logic functions.
  • Embedded Memory  Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for local buffering and state storage.
  • I/O and Gate Count  311 user I/O pins and an approximate 400,000-gate equivalent capacity to support diverse interfacing requirements.
  • Package and Mounting  400-BGA (supplier device package: 400-FBGA, 21×21), surface-mount for high pin density in a compact footprint.
  • Power  Nominal supply voltage range of 1.14 V to 1.26 V to match targeted system power architectures.
  • Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • Substantial programmable logic capacity: 8,064 logic elements and 896 CLBs support moderately complex custom logic implementations without external logic devices.
  • On-chip memory integration: Approximately 0.37 Mbits of embedded RAM reduces dependence on external memory for many buffering and control tasks.
  • High I/O availability: 311 I/O pins provide flexibility for connecting to multiple peripherals, sensors, and board-level interfaces.
  • High-density packaging: 400-BGA (21×21) delivers a compact, high-pin-count solution suitable for space-constrained PCBs.
  • Predictable power window: A defined supply voltage range (1.14 V–1.26 V) simplifies power supply design and validation.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for general commercial environments.

Why Choose XC3S400AN-5FGG400C?

The XC3S400AN-5FGG400C combines a balanced set of programmable logic, embedded memory, and I/O resources in a compact 400-BGA surface-mount package, making it well suited for commercial FPGA designs that require on-chip integration and moderate logic capacity. Its defined supply and operating temperature ranges aid predictable system-level design and qualification for commercial applications.

This device is appropriate for designers and teams seeking a commercial-grade Spartan®-3AN FPGA with a clear set of specifications for logic capacity, memory, I/O count, package, and environmental limits, enabling straightforward selection and system integration.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S400AN-5FGG400C.

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