XC3S400AN-5FGG400C
| Part Description |
Spartan®-3AN Field Programmable Gate Array (FPGA) IC 311 368640 8064 400-BGA |
|---|---|
| Quantity | 1,406 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-FBGA (21x21) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-BGA | Number of I/O | 311 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 896 | Number of Logic Elements/Cells | 8064 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 368640 |
Overview of XC3S400AN-5FGG400C – Spartan®-3AN FPGA, 8,064 logic elements, 400-BGA
The XC3S400AN-5FGG400C is a Spartan®-3AN Field Programmable Gate Array (FPGA) IC from AMD in a 400-BGA package. It delivers a combination of programmable logic, embedded memory, and a high I/O count for commercial-grade FPGA applications.
With 896 configurable logic blocks (CLBs) totaling 8,064 logic elements and approximately 0.37 Mbits of on-chip RAM, this device is targeted at commercial designs that require configurable digital logic in a compact surface-mount 400-FBGA (21×21) package.
Key Features
- Core Logic 896 configurable logic blocks (CLBs) providing 8,064 logic elements for implementing custom digital logic functions.
- Embedded Memory Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for local buffering and state storage.
- I/O and Gate Count 311 user I/O pins and an approximate 400,000-gate equivalent capacity to support diverse interfacing requirements.
- Package and Mounting 400-BGA (supplier device package: 400-FBGA, 21×21), surface-mount for high pin density in a compact footprint.
- Power Nominal supply voltage range of 1.14 V to 1.26 V to match targeted system power architectures.
- Operating Conditions Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
Unique Advantages
- Substantial programmable logic capacity: 8,064 logic elements and 896 CLBs support moderately complex custom logic implementations without external logic devices.
- On-chip memory integration: Approximately 0.37 Mbits of embedded RAM reduces dependence on external memory for many buffering and control tasks.
- High I/O availability: 311 I/O pins provide flexibility for connecting to multiple peripherals, sensors, and board-level interfaces.
- High-density packaging: 400-BGA (21×21) delivers a compact, high-pin-count solution suitable for space-constrained PCBs.
- Predictable power window: A defined supply voltage range (1.14 V–1.26 V) simplifies power supply design and validation.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation for general commercial environments.
Why Choose XC3S400AN-5FGG400C?
The XC3S400AN-5FGG400C combines a balanced set of programmable logic, embedded memory, and I/O resources in a compact 400-BGA surface-mount package, making it well suited for commercial FPGA designs that require on-chip integration and moderate logic capacity. Its defined supply and operating temperature ranges aid predictable system-level design and qualification for commercial applications.
This device is appropriate for designers and teams seeking a commercial-grade Spartan®-3AN FPGA with a clear set of specifications for logic capacity, memory, I/O count, package, and environmental limits, enabling straightforward selection and system integration.
Request a quote or submit an inquiry to receive pricing and availability for the XC3S400AN-5FGG400C.

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