XC3S50-4CPG132I

The XC3S50-4CPG132I is a Spartan®-3 Field Programmable Gate Array (FPGA) IC from AMD. It provides a moderate logic capacity with embedded memory and a defined set of I/O, packaged in a 132-TFBGA (132-CSPBGA, 8×8) surface-mount package.

Its on-chip resources — including 1,728 logic elements, approximately 73,728 bits of embedded memory and 89 I/O — make it suitable for designs that require predictable logic integration, local RAM buffering and a compact package. The device is specified for industrial-grade operation and RoHS compliance.

Key Features

• Core logic — 1,728 logic elements organized across the device to implement custom digital functions and control logic.
• Embedded memory — Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for local data storage and buffering.
• I/O capacity — 89 general-purpose I/O pins to interface with peripherals, sensors and external logic.
• Gate complexity — Equivalent to 50,000 gates for planning resource allocation in low- to mid-density designs.
• Package and mounting — 132-TFBGA / 132-CSPBGA (8×8) surface-mount package suited to space-constrained PCBs.
• Power — Operates from a 1.14 V to 1.26 V supply range, allowing low-voltage system integration.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Environmental compliance — RoHS compliant.

Typical Applications

• Embedded logic and control — Implement control state machines, protocol handlers and custom logic using the device’s 1,728 logic elements and on-chip RAM.
• I/O interfacing and glue logic — Use the 89 I/O pins to bridge peripherals, implement bus interfaces or perform signal conditioning tasks.
• Prototyping and low-density FPGA designs — Suitable for early-stage prototypes and deployed designs that require up to 50,000 gates of logic capacity in a compact package.

Unique Advantages

• Compact, industry-standard package — The 132-TFBGA (132-CSPBGA, 8×8) surface-mount package minimizes PCB area while retaining robust I/O connectivity.
• Predictable on-chip resources — A defined set of 1,728 logic elements, ~73,728 bits of embedded memory and 89 I/O simplifies hardware resource planning.
• Industrial-grade operation — Specified −40 °C to 100 °C operation supports deployment in industrial-temperature environments.
• Low-voltage operation — 1.14 V to 1.26 V supply range supports integration into low-voltage system architectures.
• Regulatory compliance — RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC3S50-4CPG132I?

The XC3S50-4CPG132I positions itself as a practical Spartan®-3 FPGA option when a compact, industrial-grade programmable logic device is required. Its combination of 1,728 logic elements, embedded memory, 89 I/O and a 132-TFBGA surface-mount package provides a clear resource profile for engineers planning low- to mid-density FPGA implementations.

Designed and manufactured by AMD and offered with RoHS compliance, this part is appropriate for projects that prioritize predictable on-chip resources, compact packaging and industrial temperature capability. It is a fit for development teams and production designs needing these specific, verifiable characteristics.

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