XC3S50-4PQG208I

The XC3S50-4PQG208I is a Spartan®-3 field programmable gate array (FPGA) IC from AMD, offering 1728 logic elements and approximately 73,728 bits of on-chip RAM. It delivers a mid-range programmable logic resource set with approximately 50,000 gates and 124 general-purpose I/Os in a 208-BFQFP surface-mount package.

Designed for industrial-grade applications, this device operates over a voltage supply range of 1.14 V to 1.26 V and an ambient temperature range of −40 °C to 100 °C, and is RoHS compliant for environmentally conscious designs.

Key Features

• Core Logic  1728 logic elements providing approximately 50,000 gates of programmable logic capacity for custom digital functions.
• Embedded Memory  Approximately 73,728 bits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
• I/O  124 available I/O pins to interface with peripherals, sensors, and external buses.
• Power  Operates from a voltage supply range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Package & Mounting  208-BFQFP surface-mount package (supplier package: 208-PQFP, 28×28) for compact PCB integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for extended-environment use.
• Compliance  RoHS compliant for environmentally regulated manufacturing requirements.

Typical Applications

• Industrial Control  Programmable logic and 124 I/Os enable custom control, interfacing, and glue-logic functions within industrial systems operating across extended temperatures.
• Embedded Systems  Mid-range logic capacity and on-chip RAM support custom peripheral handling, protocol bridging, and small-scale processing tasks in embedded designs.
• Peripheral and Sensor Interfacing  Ample I/O and a compact surface-mount package make the device suitable for integrating multiple sensors and peripheral devices on constrained PCBs.

Unique Advantages

• Balanced logic density: 1728 logic elements and ~50,000 gates provide a practical balance of resource capacity for small- to mid-sized FPGA designs.
• On-chip RAM availability: 73,728 bits of embedded memory reduce or eliminate the need for some external memory components, simplifying BOM and layout.
• Extended temperature range: Industrial rating from −40 °C to 100 °C supports deployment in harsher operating environments.
• Generous I/O count: 124 I/Os allow flexible interfacing to a variety of external devices and subsystems.
• Compact, surface-mount packaging: 208-BFQFP (28×28 supplier footprint) enables integration on space-constrained PCBs while supporting automated assembly.
• Regulatory compliance: RoHS compliance supports environmentally conscious product designs.

Why Choose XC3S50-4PQG208I?

The XC3S50-4PQG208I positions itself as a practical Spartan®-3 FPGA option for designs that require a mid-range mix of logic elements, embedded RAM, and a substantial number of I/Os in an industrial-grade package. Its specified operating temperature range and RoHS compliance make it suitable where extended environment operation and regulatory compliance are required.

Manufactured by AMD, this part delivers programmable flexibility for engineers needing on-chip resources (logic, RAM, and I/O) in a compact 208-BFQFP surface-mount form factor, enabling straightforward PCB integration and utility across a range of embedded and industrial applications.

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