XC3S50-4TQ144C

The XC3S50-4TQ144C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD, supplied in a 144-lead LQFP surface-mount package. It delivers reconfigurable logic with 1,728 logic elements, approximately 73,728 bits of on-chip RAM, and 97 user I/Os, making it suitable for compact, low-voltage commercial designs.

This device operates from a core voltage range of 1.14 V to 1.26 V and is rated for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant and provided in a 144-pin package (supplier device package listed as 144-TQFP, 20×20 mm).

Key Features

• Core Logic — 1,728 logic elements and approximately 50,000 equivalent gates to implement custom digital logic, control functions, and glue logic.
• Embedded Memory — 73,728 bits of on-chip RAM for data buffering, FIFOs, and small lookup tables.
• I/O Capacity — 97 programmable I/O pins for interfacing with peripherals, sensors, and external logic.
• Power — Core voltage range from 1.14 V to 1.26 V to support low-voltage system architectures.
• Package and Mounting — Surface-mount 144-LQFP package (supplier package: 144-TQFP, 20×20 mm) suitable for compact PCBs and standard assembly processes.
• Operating Grade and Temperature — Commercial grade with specified operating range of 0 °C to 85 °C for typical consumer and industrial-environment applications.
• Regulatory — RoHS compliant for environmental and supply-chain requirements.

Typical Applications

• Embedded Control — Implement custom state machines, control logic, and protocol bridging using the device's logic elements and plentiful I/O.
• Peripheral and Interface Expansion — Add parallel or serial interfaces and glue logic to microcontrollers or SoCs with the FPGA’s configurable I/O and on-chip RAM.
• Prototyping and Evaluation — Rapidly validate digital designs and iterate firmware/hardware co-development in a compact LQFP package.
• Consumer and Commercial Electronics — Integrate custom logic, small buffering, and I/O consolidation within temperature and voltage constraints of commercial products.

Unique Advantages

• Balanced Logic Density: 1,728 logic elements and approximately 50,000 gates provide a mid-range capacity for control and interface tasks without excessive board footprint.
• On-chip Memory Available: 73,728 bits of embedded RAM enable local buffering and small data storage, reducing the need for external memory in many designs.
• Generous I/O Count: 97 I/Os simplify system integration by supporting multiple peripherals and external signals directly to the FPGA.
• Low-Voltage Core: 1.14 V–1.26 V core operation supports modern low-voltage system architectures and power-optimized designs.
• Compact, Standard Package: 144-LQFP (supplier 144-TQFP, 20×20 mm) supports surface-mount assembly and space-constrained PCB layouts.
• RoHS Compliant: Meets common environmental requirements for contemporary electronic products.

Why Choose XC3S50-4TQ144C?

The XC3S50-4TQ144C positions itself as a commercially graded, mid-density Spartan®-3 FPGA from AMD that combines a moderate logic element count, on-chip RAM, and a substantial number of I/Os in a compact 144-lead package. Its low core voltage range and RoHS compliance make it a practical choice for designers implementing control logic, interface expansion, and compact embedded systems within commercial temperature environments.

This device is well suited to engineers seeking a reconfigurable solution that balances logic capacity, embedded memory, and I/O count while maintaining a small PCB footprint and standard surface-mount packaging.

Request a quote or submit your BOM to receive pricing and availability information for the XC3S50-4TQ144C. Our team can provide lead-time details and help match the part to your design requirements.