XC3S50-4VQ100C

The XC3S50-4VQ100C is a Spartan®-3 field programmable gate array (FPGA) IC from AMD designed for commercial embedded designs. It provides a balance of logic resources, on-chip memory and I/O in a compact 100-pin TQFP package suitable for space-constrained boards.

With 192 CLBs (1,728 logic elements), 73,728 bits of embedded RAM, 63 I/O pins, and a low-voltage core supply range, this device targets digital logic prototyping, control and interface functions where moderate density and surface-mount packaging are priorities.

Key Features

• Logic Capacity — 192 CLBs delivering 1,728 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory — 73,728 bits of on-chip RAM (approximately 0.074 Mbits) to support FIFOs, buffers and small data storage needs without external memory.
• I/O — 63 general-purpose I/O pins to interface with peripherals, sensors and external logic devices.
• Gate Equivalent — Specified at 50,000 gates to indicate overall integration scale for legacy gate-count comparisons.
• Power — Core supply voltage range of 1.14 V to 1.26 V enabling low-voltage operation and predictable power budgeting.
• Package & Mounting — Surface-mount 100-TQFP package (supplier device package: 100-VQFP, 14×14) for compact board-level integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
• Compliance — RoHS-compliant for environmentally conscious designs.

Typical Applications

• Embedded Control — Implement custom control logic and state machines in compact embedded systems using available CLBs and I/O.
• Interface Bridging — Bridge and adapt signals between peripherals and processors with 63 I/O lines and on-chip memory for buffering.
• Digital Prototyping — Rapid hardware prototyping and function validation where moderate logic density and a TQFP footprint are preferred.
• Signal Conditioning and Glue Logic — Replace discrete glue components with programmable logic to consolidate board-level functions.

Unique Advantages

• Compact, Surface-Mount Package: 100-TQFP (100-VQFP, 14×14) enables implementation on space-limited PCBs while keeping a high pin count.
• Balanced Resource Set: 192 CLBs and 1,728 logic elements paired with 73,728 bits of RAM provide both logic and local memory for moderate-complexity applications.
• Generous I/O Count: 63 I/Os simplify external device integration and minimize the need for additional interface components.
• Low-Voltage Core: 1.14 V to 1.26 V supply range supports predictable power design and integration with low-voltage systems.
• Commercial Qualification: Rated for 0 °C to 85 °C operation and RoHS-compliant, suitable for mainstream commercial deployments.

Why Choose XC3S50-4VQ100C?

The XC3S50-4VQ100C positions itself as a practical, commercially graded FPGA for engineers needing a compact, surface-mount solution with a balanced mix of logic, memory and I/O. Its combination of 192 CLBs, 1,728 logic elements and on-chip RAM makes it well suited to control, interfacing and prototyping tasks where board space and power are considerations.

Manufactured by AMD and RoHS-compliant, this device is appropriate for design teams seeking a proven FPGA footprint in a 100-pin TQFP package, delivering predictable integration and deployment for commercial embedded systems.

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