XC3S50-4VQG100C

The XC3S50-4VQG100C is an AMD Spartan®-3 field programmable gate array provided in a 100-pin thin quad flat package (100-TQFP). It offers a compact, surface-mount FPGA option with 1.14 V to 1.26 V supply range and commercial operating temperature from 0 °C to 85 °C.

On-chip resources include 192 CLBs, 1,728 logic elements, approximately 0.074 Mbits of embedded memory (73,728 bits), 63 I/Os and a logic capacity equivalent to 50,000 gates, making it suitable for modest-density digital designs that require reprogrammable hardware logic in a 100-TQFP footprint.

Key Features

• Core Logic — 192 CLBs and 1,728 logic elements provide flexible, reprogrammable digital logic resources for custom logic implementation and control functions.
• Logic Capacity — Approximately 50,000 gates of logic capacity to support moderate-complexity designs.
• Embedded Memory — Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, small lookup tables, and state storage.
• I/O — 63 general-purpose I/O pins for interfacing with peripherals, sensors, and external logic.
• Power — Supports a supply voltage range of 1.14 V to 1.26 V suitable for the device core.
• Package and Mounting — 100-TQFP package (supplier device package: 100-VQFP 14×14) in a surface-mount form factor to fit compact PCB layouts.
• Temperature and Grade — Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance — RoHS compliant, meeting common lead-free requirements.

Typical Applications

• Prototyping and Development — Use the XC3S50-4VQG100C for early hardware validation and iterative FPGA-based prototypes where reprogrammable logic and modest resource counts are sufficient.
• Embedded Control — Implement control logic, state machines, and peripheral interfaces leveraging 1,728 logic elements and 63 I/Os for compact embedded systems.
• Glue Logic and Interface Bridging — Replace discrete glue logic with programmable logic to consolidate functions and reduce component count on the PCB.

Unique Advantages

• Compact FPGA in TQFP — 100-TQFP packaging enables FPGA integration in space-constrained designs without requiring BGA mounting.
• Balanced Resource Set — Combination of 192 CLBs, 1,728 logic elements and on-chip RAM supports a range of mid-density digital functions in a single device.
• Ample I/O Count — 63 I/Os provide flexibility for signal interfacing and peripheral connections without external expander logic.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation, matching common commercial product requirements.
• RoHS Compliant — Meets environmental regulations for lead-free assembly and manufacturing processes.

Why Choose XC3S50-4VQG100C?

The XC3S50-4VQG100C provides a practical balance of logic, memory and I/O in a surface-mount 100-TQFP package from AMD’s Spartan®-3 family. Its resource mix—1,728 logic elements, 192 CLBs, roughly 0.074 Mbits of embedded RAM, and 63 I/Os—makes it well suited to developers and designers implementing moderate-complexity digital logic, control functions, and interface consolidation in commercial-temperature applications.

Backed by AMD documentation and provided as a RoHS-compliant commercial-grade device, the XC3S50-4VQG100C is positioned for designs that require reprogrammable hardware functionality in a compact, solderable package while maintaining predictable supply voltage and operating-temperature requirements.

Request a quote or submit an inquiry to receive pricing and availability for the XC3S50-4VQG100C.