XC3S50-5TQG144C

The XC3S50-5TQG144C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD. It provides a moderate-density, configurable logic resource set suitable for a wide range of commercial embedded designs.

Key device characteristics include 1,728 logic elements across 192 CLBs, 73,728 bits of on-chip RAM, support for approximately 50,000 gates, 97 I/O pins, and a 144-LQFP surface-mount package. The device operates with a core supply range of 1.14 V to 1.26 V and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic 192 CLBs providing 1,728 logic elements for implementing state machines, custom logic and glue functions; listed device gate count is 50,000.
• Embedded Memory 73,728 bits of on-chip RAM for small buffers, FIFOs and lookup tables.
• I/O 97 general-purpose I/O pins to support multiple external interfaces and peripherals.
• Power Core voltage supply range from 1.14 V to 1.26 V for system power planning and integration.
• Package & Mounting 144-LQFP package (supplier device package: 144-TQFP 20 × 20) in a surface-mount form factor for compact PCB designs.
• Operating Range & Grade Commercial grade device with operating temperature specified from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Embedded control and glue logic — Use the 1,728 logic elements and 97 I/O to implement control state machines, bus bridging and custom interface logic.
• Protocol conversion and peripheral interfacing — 97 I/O pins enable implementation of simple protocol adapters and multi-peripheral interfaces on a single device.
• Small data buffering and lookup tables — 73,728 bits of on-chip RAM support buffering, small FIFOs and table-driven logic for data path tasks.
• Compact system integration — 144-LQFP surface-mount package helps keep PCB footprint low for space-constrained commercial products.

Unique Advantages

• Balanced resource set: 1,728 logic elements and 73,728 bits of RAM deliver a combination of logic and memory for moderate-density designs.
• Significant gate count: Rated at 50,000 gates to accommodate a variety of glue-logic and modest processing tasks.
• Flexible I/O capacity: 97 I/O pins provide room for multiple interfaces without external I/O expanders.
• Standard surface-mount package: 144-LQFP (20 × 20) supports streamlined PCB assembly and compact layouts.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for general-purpose commercial applications.
• RoHS compliant: Meets environmental regulations for lead-free assembly.

Why Choose XC3S50-5TQG144C?

The XC3S50-5TQG144C delivers a practical balance of logic capacity, embedded memory and I/O in a compact 144-LQFP package from AMD's Spartan®-3 family. Its combination of 1,728 logic elements, 73,728 bits of RAM and up to 97 I/O pins makes it well suited to commercial embedded designs that require configurable logic, modest on-chip storage and a standard surface-mount footprint.

Engineers seeking a commercially graded FPGA with a clear set of resources for glue logic, protocol adapters or small data-path implementations will find this device a straightforward option for mid-range integration and space-constrained boards.

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