XC3S5000-4FG676I

The XC3S5000-4FG676I is a Spartan®-3 field programmable gate array (FPGA) from AMD designed for implementing configurable digital logic in space-constrained, surface-mount applications. It provides a substantial logic fabric with 74,880 logic elements and an estimated 5,000,000 gates to support complex custom logic functions.

This device includes approximately 1.9 Mbits of embedded memory, 489 user I/O pins, and operates from a core supply range of 1.14 V to 1.26 V. Packaged in a 676-FBGA (27 × 27) surface-mount package and rated to industrial operating temperatures (−40 °C to 100 °C), the XC3S5000-4FG676I is RoHS-compliant for environmentally conscious designs.

Key Features

• Core Logic Provides 74,880 logic elements for implementing complex combinational and sequential logic as well as state machines and custom datapaths.
• Embedded Memory Includes approximately 1.9 Mbits of on-chip RAM to support buffering, look-up tables, and local storage without external memory.
• I/O Capacity Features 489 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Gate Count Approximately 5,000,000 gates to accommodate feature-rich designs and integration of multiple functions on a single device.
• Power Core voltage supply range of 1.14 V to 1.26 V for predictable power planning and integration with system power rails.
• Package & Mounting Supplied in a 676-FBGA (27 × 27) surface-mount package (676-BGA case) for compact board-level integration.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Environmental Compliance RoHS-compliant to meet regulatory requirements for lead-free manufacturing.

Typical Applications

• Custom Digital Logic Implement complex, application-specific logic functions using the device’s 74,880 logic elements and large gate count.
• I/O-Intensive Interfaces Leverage 489 I/O pins to connect multiple parallel buses, sensors, or peripherals without external I/O expanders.
• Memory-Dependent Functions Use approximately 1.9 Mbits of embedded RAM for buffering, FIFOs, and small on-chip data storage needs.
• Industrial Control Systems Industrial temperature rating and rugged packaging make the device suitable for embedded controllers in industrial environments.

Unique Advantages

• High Logic Density: 74,880 logic elements and ~5 million gates allow consolidation of multiple functions onto a single FPGA, reducing board-level BOM.
• Significant On-Chip Memory: Approximately 1.9 Mbits of embedded RAM supports local buffering and reduces dependence on external memory devices.
• Extensive I/O Count: 489 I/O pins enable direct interfacing to a wide range of peripherals and parallel interfaces, simplifying system design.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet thermal requirements for industrial applications and extended-environment deployments.
• Compact BGA Packaging: 676-FBGA (27 × 27) surface-mount package supports high I/O density in a compact form factor for space-constrained boards.
• Regulatory Compliance: RoHS-compliant construction supports lead-free manufacturing processes.

Why Choose XC3S5000-4FG676I?

The XC3S5000-4FG676I combines substantial logic capacity, on-chip memory, and a high I/O count in a compact 676-FBGA package, making it a solid choice for designers who need to integrate multiple digital functions on a single device. Its industrial temperature rating and RoHS compliance make it suitable for production deployments that require environmental robustness and regulatory conformance.

Ideal for engineers building complex, I/O-rich systems that require significant on-chip resources, this AMD Spartan®-3 FPGA balances integration and reliability for medium-to-high complexity embedded designs.

Request a quote today to evaluate the XC3S5000-4FG676I for your design needs and to obtain pricing and availability information.