XC3S5000-4FG900I

The XC3S5000-4FG900I is a Spartan®-3 field programmable gate array designed for industrial applications requiring large amounts of reconfigurable logic, high I/O count, and on-chip memory. It combines 8,320 configurable logic blocks (CLBs) — providing 74,880 logic elements — with substantial embedded RAM and a broad I/O complement to support complex digital designs.

Key Features

• Logic Capacity 8,320 configurable logic blocks (CLBs) delivering 74,880 logic elements and an estimated 5,000,000 gates for implementing substantial custom logic and state machines.
• Embedded Memory Approximately 1.9 Mbits of on-chip RAM (1,916,928 total RAM bits) for data buffering, FIFOs, and small on-chip storage.
• I/O and Integration 633 user I/O pins to support dense peripheral interfacing, parallel buses, and high-pin-count system connections.
• Power and Voltage Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design requirements.
• Package and Mounting 900-ball BBGA package (supplier package: 900-FBGA, 31 × 31) in a surface-mount form factor for compact board-level integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet industrial environmental conditions.
• Regulatory RoHS compliant, supporting lead-free assembly and regulatory requirements.

Typical Applications

• Industrial Control Systems — Use the device’s extensive logic and I/O to implement custom control algorithms, motor interfaces, and fieldbus bridging within industrial equipment.
• Communications and Networking — Leverage high logic density and numerous I/Os for packet processing, protocol bridging, and custom interface implementations.
• Data Acquisition and Test Equipment — Deploy embedded RAM and abundant I/O for real-time data buffering, signal conditioning, and test instrumentation control.
• Embedded System Prototyping — Rapidly iterate hardware-software partitioning and validate complex digital functions using reprogrammable logic and high I/O count.

Unique Advantages

• High Logic Integration: 74,880 logic elements and 8,320 CLBs enable substantial custom digital designs without immediate external ASIC development.
• Generous On-Chip RAM: Approximately 1.9 Mbits of embedded memory reduces reliance on external RAM for many buffering and queuing tasks.
• Extensive I/O Density: 633 I/O pins support complex interconnects and multiple parallel interfaces, simplifying board-level routing for high-pin-count systems.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to withstand a wide range of operating environments common in industrial deployments.
• Compact Surface-Mount Package: 900-ball BBGA (31 × 31) supports high integration in space-constrained designs while enabling surface-mount assembly.
• Regulatory Compliance: RoHS compliance facilitates lead-free manufacturing processes and regulatory alignment.

Why Choose XC3S5000-4FG900I?

The XC3S5000-4FG900I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a balance of large logic resources, substantial on-chip RAM, and a high I/O count. Its voltage supply range, package density, and extended temperature rating make it suitable for embedded and industrial projects that demand reliable, reconfigurable hardware.

Choose this device when your design calls for plentiful programmable logic, robust I/O capabilities, and on-chip memory to consolidate functions on a single FPGA, helping simplify system architecture and reduce component count.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the XC3S5000-4FG900I.