XC3S5000-4FGG900C

The XC3S5000-4FGG900C is a Spartan®-3 family Field Programmable Gate Array from AMD, offering a high-density, commercial-grade programmable logic solution. It combines a large logic fabric with substantial on-chip memory and extensive I/O, making it suitable for complex digital designs that require significant integration and flexible interfacing.

Key Features

• Logic Capacity — 74,880 logic elements provide substantial programmable resources for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 1.9 Mbits of on-chip RAM supports local buffering, state storage, and memory-intensive logic without immediate external memory dependency.
• I/O Density — 633 user I/O pins enable wide peripheral and bus interfacing for systems requiring high connectivity.
• Gate Equivalent — 5,000,000 gates of equivalent logic capacity for building large-scale digital systems within a single device.
• Power — Core supply range from 1.14 V to 1.26 V designed for stable operation within specified voltage limits.
• Package & Mounting — 900-BBGA package (supplier device package: 900-FBGA, 31×31) with surface-mount construction for compact board-level integration.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Standards Compliance — RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital systems — Use the large logic element count to consolidate multiple functions into a single FPGA for space- and cost-efficient designs.
• Memory-centric processing — Approximately 1.9 Mbits of embedded RAM supports data buffering and intermediate storage for signal processing or control logic.
• Complex I/O interfacing — 633 I/O pins enable broad peripheral connections and multi-channel interfacing for embedded and communication systems.

Unique Advantages

• Highly integrated logic and memory: 74,880 logic elements combined with ~1.9 Mbits of on-chip RAM reduce reliance on external components and simplify board design.
• Extensive connectivity: 633 I/O pins allow dense peripheral and bus integration, shortening development cycles for complex systems.
• Significant gate-equivalent capacity: 5,000,000 gates of logic capacity enable large, feature-rich implementations within a single FPGA package.
• Compact surface-mount package: 900-BBGA (900-FBGA, 31×31) supports high-density PCB layouts and efficient use of board real estate.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation, matching the thermal requirements of many standard electronic products.
• Environmental compliance: RoHS compliance supports regulatory and manufacturing requirements for many markets.

Why Choose XC3S5000-4FGG900C?

The XC3S5000-4FGG900C delivers a balance of high logic capacity, substantial embedded memory, and expansive I/O in a compact 900-BBGA package. Its commercial-grade rating and RoHS compliance make it a practical choice for designers targeting high-density, board-level digital systems that require on-chip resources and broad interfacing capability.

This device is well suited for design teams needing to consolidate functionality, reduce BOM complexity, and deploy scalable logic solutions where a large number of logic elements, on-chip RAM, and I/O are required within the specified operating and power ranges.

Request a quote or submit a parts inquiry to obtain pricing and availability for the XC3S5000-4FGG900C. Our team can provide lead-time information and support your procurement needs.