XC3S5000-4FGG676I

The XC3S5000-4FGG676I is a Spartan®-3 field programmable gate array (FPGA) offered in a 676-ball fine-pitch BGA package. It provides high logic capacity and significant embedded memory in a surface-mount, industrial-grade device designed for designs that require substantial I/O and on-chip resources.

With a large population of logic elements, nearly 1.92 Mbits of on-chip RAM and 489 I/O pins, this FPGA targets applications where integration density, robust I/O count and industrial temperature operation are important considerations.

Key Features

• Logic Capacity — 74,880 logic elements supporting complex digital designs and wide FPGA partitioning.
• Embedded Memory — Approximately 1.92 Mbits of on-chip RAM for buffering, lookup tables and state storage.
• I/O Resources — 489 available I/O pins to support high-pin-count interfaces and multiple parallel connections.
• Gate Count — 5,000,000 gates of implementation capacity for substantial programmable logic integration.
• Power — Core voltage supply range from 1.14 V to 1.26 V to match system power rails and design margins.
• Package & Mounting — 676-ball FBGA package (27×27 mm) in a surface-mount form factor for compact board layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliant — Meets RoHS environmental requirements for restricted substances.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature rating and abundant logic resources make it suitable for control logic, data aggregation and real-time processing modules.
• High‑Density Interface Bridging — Large I/O count supports designs that require many parallel interfaces or board-level signal aggregation.
• Memory‑Intensive Logic — Approximately 1.92 Mbits of embedded memory enables buffering, packet handling and intermediate data storage within the FPGA fabric.
• System Integration and Prototyping — High gate and logic element counts are useful for integrating multiple functions and validating complex digital systems.

Unique Advantages

• High Integration Density: 74,880 logic elements and 5,000,000 gates let designers consolidate multiple functions into a single device, reducing BOM complexity.
• Substantial On‑Chip Memory: Approximately 1.92 Mbits of embedded RAM supports local data storage and reduces external memory dependence.
• Extensive I/O Resources: 489 I/O pins accommodate multiple interfaces and high-pin-count peripherals without external expanders.
• Industrial Robustness: Rated for −40 °C to 100 °C operation, suitable for deployments where extended ambient ranges are required.
• Compact Surface-Mount Package: 676-FBGA (27×27) offers a space-efficient footprint for dense PCB designs.
• Regulatory Compliance: RoHS compliance aligns with environmental and regulatory requirements for many markets.

Why Choose XC3S5000-4FGG676I?

The XC3S5000-4FGG676I positions itself as a high-capacity Spartan®-3 FPGA option that balances large programmable logic density, significant embedded memory and an extensive I/O complement within a compact 676-FBGA package. Its industrial temperature rating and surface-mount form factor make it a suitable selection for customers building robust, integrated digital systems where board space and environmental resilience matter.

This device is well suited to design teams needing substantial on-chip resources for consolidation of functions, rapid prototyping of complex logic, or deployment in environments that demand industrial-grade operating ranges. The combination of logic, memory and I/O provides long-term scalability for evolving system requirements.

Request a quote or submit a sales inquiry to check availability, lead times and pricing for the XC3S5000-4FGG676I.