XC3S5000-4FGG900I

The XC3S5000-4FGG900I is a Spartan®-3 Field Programmable Gate Array from AMD, provided in a 900-BBGA surface-mount package. It delivers a combination of high logic capacity, substantial on-chip memory, and a large I/O count targeted at industrial applications.

With 74,880 logic elements, approximately 1.92 Mbits of embedded memory, 633 I/O pins and an operating range from -40 °C to 100 °C, this device is specified for designs that require dense programmable logic and robust industrial-temperature operation.

Key Features

• Core Logic — 74,880 logic elements supporting a gate-equivalent count of 5,000,000 to handle complex programmable logic implementations.
• Embedded Memory — Approximately 1.92 Mbits (1,916,928 bits) of on-chip RAM for local storage and buffering within custom logic designs.
• I/O Capacity — 633 user I/O pins to support extensive peripheral and interface connectivity.
• Power — Nominal core voltage supply range of 1.14 V to 1.26 V to match system power requirements.
• Package & Mounting — 900-BBGA package, supplier device package listed as 900-FBGA (31 × 31), with surface-mount mounting type for compact board integration.
• Temperature & Grade — Industrial grade device rated for operation from -40 °C to 100 °C for deployments in demanding ambient conditions.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems — Use the device where industrial-temperature operation and a high I/O count are required for sensor, actuator and control interfacing.
• High-density Digital Processing — Suitable for designs that need significant logic capacity and gate count for custom data-paths and processing engines.
• Memory-intensive Logic — On-chip RAM (approximately 1.92 Mbits) supports buffering, state machines and local data storage within embedded systems.
• Board-level Integration — 900-BBGA surface-mount package enables compact PCB designs requiring a high pin count.

Unique Advantages

• High Logic Capacity: 74,880 logic elements and 5,000,000 gate-equivalents provide the resources to implement complex, custom logic functions on a single device.
• Substantial On-chip Memory: Approximately 1.92 Mbits of embedded RAM reduces dependence on external memory for local buffering and state storage.
• Extensive I/O: 633 I/O pins accommodate a wide range of peripheral connections and high-density interface requirements.
• Industrial Temperature Range: Specified for -40 °C to 100 °C operation, supporting deployment in harsh or temperature-variable environments.
• Compact, High-density Packaging: 900-BBGA (supplier 900-FBGA, 31 × 31) in a surface-mount form factor enables space-efficient PCB layouts.
• Regulatory Compliance: RoHS compliance facilitates integration into lead-free assemblies and meets environmental requirements.

Why Choose XC3S5000-4FGG900I?

The XC3S5000-4FGG900I combines substantial logic resources, embedded memory and a very high I/O count in an industrial-grade FPGA from AMD. Its specification set — including 74,880 logic elements, approximately 1.92 Mbits of on-chip RAM, 633 I/O, a 1.14–1.26 V supply range and -40 °C to 100 °C operating range — positions it for dense, reliable programmable-logic implementations in industrial and other temperature-demanding applications.

This part is suited to engineers and designers who need integrated logic capacity and memory on a single device while maintaining a compact board footprint via a 900-BBGA surface-mount package. The industrial grade and RoHS compliance add to its suitability for long-term product deployments where environmental and regulatory considerations matter.

Request a quote or submit an RFQ to obtain pricing and availability for the XC3S5000-4FGG900I.