XC3S5000-5FGG676C

The XC3S5000-5FGG676C is a Spartan®-3 field programmable gate array (FPGA) from AMD, provided in a 676-ball BGA package. Designed for commercial applications, it combines high logic density, substantial embedded memory, and a large I/O count to support complex programmable logic implementations in a compact surface-mount footprint.

Key Features

• Logic Capacity  Provides 74,880 logic elements (cells) and approximately 5,000,000 gates to implement complex digital designs.
• Embedded Memory  Includes a total of 1,916,928 bits of on-chip RAM — approximately 1.9 Mbits of embedded memory for buffering and local data storage.
• I/O Density  Offers 489 user I/O pins to support extensive peripheral and interface connectivity.
• Package & Mounting  Supplied in a 676-BGA package (supplier device package: 676-FBGA, 27×27) with surface-mount mounting for compact PCB integration.
• Power  Operates from a core voltage supply range of 1.14 V to 1.26 V, suitable for the device’s internal power requirements.
• Operating Range  Commercial-grade operation specified for 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Commercial embedded systems  Programmable logic implementations that require high logic element counts and on-chip RAM for control, glue logic, or custom processing functions.
• High-density logic designs  Applications needing approximately 5,000,000 gates of logic capacity in a compact BGA package.
• Interface-rich systems  Designs that benefit from a large number of I/O — 489 user I/O pins — for connecting multiple peripherals and external devices.

Unique Advantages

• High logic density: 74,880 logic elements enable implementation of sizable digital functions without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 1.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and local-storage tasks.
• Extensive I/O capability: 489 I/O pins provide flexibility for broad peripheral interfacing and custom I/O configurations.
• Compact, high-pin-count package: The 676-FBGA (27×27) package offers a high pin count in a surface-mount form factor suitable for dense board layouts.
• Commercial operating range: Specified for 0 °C to 85 °C to match common commercial deployment environments.
• RoHS compliant: Meets RoHS requirements to support environmentally conscious product designs.

Why Choose XC3S5000-5FGG676C?

The XC3S5000-5FGG676C positions itself as a commercial-grade Spartan®-3 FPGA that balances high logic capacity, on-chip memory, and a large I/O count in a compact 676-BGA surface-mount package. It is suitable for designers and teams building commercial embedded systems and high-density logic implementations that require significant programmability and interfacing capability.

Manufactured by AMD, this device offers a clear specification set — logic elements, memory capacity, I/O count, power range, package, and operating temperature — to help engineering and procurement teams evaluate fit and long-term value for their programmable logic designs.

Request a quote or submit a pricing inquiry to evaluate availability and obtain commercial pricing for the XC3S5000-5FGG676C.