XC3S500E-4CP132I

The XC3S500E-4CP132I is an industrial-grade Spartan®-3E field programmable gate array (FPGA) IC from AMD, supplied in a 132-TFBGA / 132-CSPBGA (8×8) package for surface-mount assembly. It delivers a mid-range complement of programmable logic resources, embedded memory, and I/O suitable for configurable digital logic in industrial and embedded applications.

With 1,164 configurable logic blocks, 10,476 logic elements and approximately 0.369 Mbits of on-chip RAM, this device provides a balance of gate density and on-chip storage while operating across a wide supply and temperature range for robust system integration.

Key Features

• Core Logic — 1,164 configurable logic blocks (CLBs) and 10,476 logic elements provide capacity for implementing custom digital functions and finite-state logic.
• Gate Count — 500,000 gates to quantify overall device complexity and integration potential.
• Embedded Memory — Approximately 0.369 Mbits of on-chip RAM for buffering, small data tables, and intermediate storage without external memory.
• I/O Capacity — 92 general-purpose I/O pins to interface with peripherals, sensors, and other system components.
• Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power design for the FPGA core.
• Package & Mounting — 132-TFBGA package (supplier package: 132-CSPBGA 8×8) for compact, surface-mount PCB assembly.
• Temperature & Grade — Industrial grade with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Environmental Compliance — RoHS compliant for adherence to standard lead-free manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Implement control logic, sensor interfacing, and custom sequencing using the device’s industrial temperature rating and ample I/O.
• Embedded System Integration — Use the FPGA’s logic resources and on-chip RAM to offload custom algorithms, glue logic, and peripheral handling in embedded platforms.
• Communications and Protocol Bridging — Provide protocol adaptation and interface translation leveraging the available logic elements and I/O count.
• Prototyping and Custom IP — Rapidly iterate and validate custom digital designs with the device’s reprogrammable logic and mid-range resource set.

Unique Advantages

• Balanced Logic Capacity: A mid-range mix of 1,164 CLBs and 10,476 logic elements supports moderately complex designs without unnecessary overspecification.
• On-Chip Memory: Approximately 0.369 Mbits of embedded RAM reduces dependence on external memory for small buffers and LUT-based data structures.
• Industrial Reliability: Rated for −40°C to 100°C operation and identified as industrial grade, enabling reliable operation in temperature-stressed environments.
• Practical I/O Count: 92 I/O pins provide flexible connectivity for sensors, actuators, and peripheral interfaces in compact systems.
• Compact BGA Packaging: 132-TFBGA / 132-CSPBGA (8×8) packaging supports space-constrained PCB layouts and surface-mount manufacturing.
• Regulatory Compliance: RoHS compliance supports lead-free assembly requirements and environmental compliance objectives.

Why Choose XC3S500E-4CP132I?

The XC3S500E-4CP132I offers a practical combination of programmable logic, embedded memory, and I/O capacity in an industrial-grade Spartan®-3E FPGA package. Its specification set is well suited to engineers needing a mid-range, surface-mount FPGA for industrial and embedded applications that require reliable operation across a wide temperature range.

This device is appropriate for designs that demand moderate gate density, on-chip RAM for buffering or lookup functions, and a compact BGA footprint for optimized PCB area. Its clear electrical and mechanical specifications make it straightforward to integrate into systems where predictable power, thermal, and assembly requirements are important.

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