XC3S500E-4FG320C

The XC3S500E-4FG320C is an AMD Spartan®-3E FPGA in a 320-ball BGA package designed for commercial electronic designs. It provides programmable logic resources, embedded memory, and a high count of configurable I/O to address a range of integration needs in surface-mount assemblies.

With 10,476 logic elements, approximately 0.37 Mbits of on-chip RAM, and 232 I/O pins, this device delivers a balance of logic capacity, memory, and I/O density while operating over a 1.14 V to 1.26 V core supply range and a commercial temperature window of 0 °C to 85 °C.

Key Features

• Programmable Logic Capacity  10,476 logic elements provide significant on-chip combinational and sequential resources for custom digital functions and glue logic.
• Embedded Memory  Approximately 368,640 bits (≈0.37 Mbits) of on-chip RAM for data buffering, FIFO implementation, and small memory structures without external RAM.
• I/O Density  232 user I/O pins suitable for interfacing with peripherals, sensors, and external buses in compact designs.
• Logic Scale  Approximately 500,000 gates of equivalent logic capacity for mid-range integration tasks.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power domains and optimize power usage.
• Package and Mounting  320-ball BGA (supplier package: 320-FBGA, 19×19) in a surface-mount form factor for dense board-level integration.
• Operating Conditions  Commercial-grade temperature rating from 0 °C to 85 °C for standard industrial and consumer applications.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Unique Advantages

• Balanced Logic and Memory: Combines 10,476 logic elements with approximately 0.37 Mbits of embedded RAM to implement control, data-path, and buffering functions on a single device.
• High I/O Count: 232 I/O pins enable direct interfacing with multiple peripherals and buses, reducing the need for external I/O expanders.
• Compact BGA Package: The 320-BGA (320-FBGA, 19×19) package provides a high pin count in a compact footprint for space-constrained PCBs.
• Low-Voltage Core: A 1.14 V to 1.26 V core supply window supports efficient power design and compatibility with modern power domains.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to meet the requirements of standard commercial electronic products.
• Regulatory Compliance: RoHS compliance supports environmentally responsible product development.

Why Choose XC3S500E-4FG320C?

The XC3S500E-4FG320C positions itself as a mid-range Spartan®-3E FPGA option that delivers a practical mix of logic, memory, and I/O for commercial electronic designs. Its combination of approximately 10.5k logic elements, on-chip RAM, and a 232-pin I/O profile makes it suitable for designs that require moderate integration without external logic proliferation.

Manufactured by AMD and provided in a compact 320-BGA surface-mount package, this device is well suited to engineers and procurement teams looking for a programmable solution that balances capacity, board-level density, and standard operating conditions. Detailed device characteristics are available in the vendor datasheet for design validation and integration planning.

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