XC3S500E-4FGG320C

The XC3S500E-4FGG320C is a Spartan®-3E field programmable gate array (FPGA) in a 320-ball BGA package designed for commercial-grade applications. It delivers a balance of programmable logic capacity, on-chip memory, and I/O density for custom digital logic and system integration tasks.

Key device characteristics include approximately 10,476 logic elements, roughly 368,640 bits of embedded memory, 232 user I/O pins, and an operating voltage range of 1.14 V to 1.26 V, all in a surface-mount 320-FBGA (19×19) package.

Key Features

• Programmable Logic Capacity  Approximately 10,476 logic elements provide flexible resources for glue logic, state machines, and medium-complexity custom logic implementations.
• Embedded Memory  About 368,640 bits of on-chip RAM support buffering, FIFOs, and small data storage without external memory devices.
• I/O Density  232 user I/O pins enable multiple parallel interfaces and signal routing for mixed-signal front ends and digital subsystems.
• Gate Count  A device gate equivalent of 500,000 offers a reference point for mapping design complexity and resource planning.
• Package & Mounting  320-BGA package (supplier device package: 320-FBGA, 19×19) in a surface-mount format for compact PCB layouts and reliable solder attachment.
• Power  Specified core supply range from 1.14 V to 1.26 V for system power budgeting and voltage rail design.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C to meet standard commercial-environment requirements.
• Regulatory Status  RoHS compliant for lead-free manufacturing flows.

Typical Applications

• Custom Digital Logic  Use the device’s ~10,476 logic elements to implement application-specific finite state machines, protocol handlers, and glue logic in compact systems.
• Interface Bridging and I/O Expansion  With 232 I/O pins, the FPGA supports parallel and serial interface aggregation, protocol conversion, and I/O buffering tasks on a single device.
• Embedded Memory Tasks  Approximately 368,640 bits of on-chip RAM make the device suitable for small buffers, FIFOs, and temporary data storage without external RAM.

Unique Advantages

• Balanced Logic and Memory Mix  Combines roughly 10,476 logic elements with about 368 kbits of embedded memory to support both control logic and on-chip data storage in one device.
• High I/O Count  232 available I/O pins reduce the need for external I/O expanders and simplify board-level interface design.
• Compact BGA Packaging  320-FBGA (19×19) package enables higher routing density and smaller PCB footprint for space-constrained designs.
• Commercial Temperature Range  Rated 0 °C to 85 °C for reliable operation in typical commercial environments.
• RoHS Compliant  Supports lead-free assembly processes and regulatory compliance for many global markets.

Why Choose XC3S500E-4FGG320C?

The XC3S500E-4FGG320C positions itself as a practical FPGA option for designers needing a solid mix of logic capacity, embedded memory, and I/O in a compact BGA package. Its specified core voltage range and commercial operating temperature make it suitable for standard embedded and electronic product designs that require reliable programmable logic without exotic power or thermal requirements.

This device is well suited for teams designing medium-complexity digital subsystems, interface modules, or prototype hardware that benefits from integrated RAM and high I/O count, while fitting onto space-constrained PCBs using a 320-FBGA footprint.

If you would like pricing or availability for XC3S500E-4FGG320C, request a quote or submit an inquiry to receive a customized response for your project needs.