XC3S500E-4FG320I

The XC3S500E-4FG320I is a Spartan®-3E Field Programmable Gate Array (FPGA) in a 320-ball BGA package. It provides a balance of logic capacity, on-chip memory, and I/O count for industrial-grade embedded designs.

With 10,476 logic elements, approximately 0.37 Mbits of embedded memory and 232 I/O, this device is suited to applications that require mid-range programmable logic in a compact surface-mount package.

Key Features

• Logic Capacity  Approximately 10,476 logic elements to implement custom logic, state machines, and control functions.
• Embedded Memory  Approximately 0.37 Mbits of on-chip RAM for buffering, FIFOs, and small data storage.
• I/O Resources  232 user I/O pins for interfacing to peripherals, sensors, and external devices.
• Gate Count  Designed around 500,000 gates to support complex combinational and sequential circuits.
• Package  320-BGA surface-mount package (Supplier device package: 320-FBGA, 19×19) for compact board integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power requirements.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for reliable operation in harsh environments.
• Compliance  RoHS compliant, meeting common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use the device for digital control logic, motor drivers, and machine interfacing where an industrial temperature range and robust I/O are required.
• Embedded Processing  Implement custom peripheral glue logic, protocol bridges, and real-time control functions leveraging the available logic elements and on-chip RAM.
• Communications Interfaces  Deploy as an I/O aggregator or protocol adapter with abundant user I/O for connecting to external transceivers and PHYs.

Unique Advantages

• Balanced Logic and Memory: The mix of ~10,476 logic elements and ~0.37 Mbits of embedded RAM supports mid-range logic integration without external memory for many tasks.
• High I/O Count: 232 user I/O pins simplify board-level routing and reduce the need for external I/O expanders.
• Industrial Temperature Rating: Rated −40 °C to 100 °C to meet demanding environmental requirements in industrial systems.
• Compact BGA Package: 320-BGA (320-FBGA, 19×19) enables dense PCB layouts while maintaining surface-mount assembly compatibility.
• Controlled Power Window: Narrow core supply range (1.14 V–1.26 V) helps define power delivery design and voltage regulator selection.
• RoHS Compliance: Meets environmental manufacturing standards for lead-free production.

Why Choose XC3S500E-4FG320I?

The XC3S500E-4FG320I positions itself as a practical mid-range FPGA offering a combination of logic capacity, embedded memory, and extensive I/O in a compact industrial-grade package. It is suitable for engineers who need a programmable logic device that fits into space-constrained PCBs while meeting industrial operating temperatures.

This part delivers a clear specification set—logic elements, on-chip RAM, gate count, I/O, package, and power requirements—that helps streamline design decisions and BOM planning for embedded and industrial applications.

Request a quote for the XC3S500E-4FG320I to check availability, pricing, and lead times for your next project.