XC3S500E-4FT256C
| Part Description |
Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA |
|---|---|
| Quantity | 838 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 190 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1164 | Number of Logic Elements/Cells | 10476 | ||
| Number of Gates | 500000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 368640 |
Overview of XC3S500E-4FT256C – Spartan®-3E FPGA, 190 I/O, 256-LBGA
The XC3S500E-4FT256C is a Spartan®-3E field programmable gate array (FPGA) supplied in a 256-LBGA package. It delivers moderate logic capacity and embedded memory in a compact, surface-mount footprint for commercial electronic designs.
Designed for applications that require configurable digital logic, the device provides 10,476 logic elements, approximately 0.369 Mbits of embedded memory, and 190 I/O pins while operating over a commercial temperature range.
Key Features
- Logic Capacity — 10,476 logic elements for implementing custom digital functions and control logic.
- Embedded Memory — Approximately 0.369 Mbits of on-chip RAM (368,640 bits) to support buffering, state storage, and small FIFOs.
- Gate Count — 500,000 gates providing the silicon resource scale for medium-complexity designs.
- I/O — 190 user I/O pins to support multiple peripherals and external interfaces.
- Power — Core supply range 1.14 V to 1.26 V for the programmable core.
- Package & Mounting — 256-LBGA (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board layouts.
- Temperature & Grade — Commercial grade operation from 0°C to 85°C.
- Compliance — RoHS compliant.
Typical Applications
- Digital Prototyping — Implement and iterate custom logic and control functions during hardware development.
- Embedded Control — Integrate state machines, protocol handling, and control logic where moderate logic density is required.
- Connectivity Interfaces — Provide programmable I/O and glue logic between processors, sensors, and peripherals using the available 190 I/Os.
Unique Advantages
- Configurable Logic Density: 10,476 logic elements enable implementation of a wide range of medium-complexity designs without external glue logic.
- On-Chip Memory: Approximately 0.369 Mbits of embedded RAM reduces reliance on external memory for buffering and small data storage.
- Ample I/O: 190 I/O pins support multiple interfaces and peripheral connections, simplifying board-level design.
- Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) provides a space-efficient solution for area-constrained PCBs.
- Commercial Temperature Range: Rated for 0°C to 85°C, suitable for standard commercial electronics applications.
- Regulatory Compliance: RoHS compliant for use in environmentally regulated manufacturing processes.
Why Choose XC3S500E-4FT256C?
The XC3S500E-4FT256C positions itself as a compact, commercial-grade FPGA option offering a balance of logic resources, embedded memory, and I/O in a small package. Its combination of 10,476 logic elements, roughly 0.369 Mbits of on-chip RAM, and 190 I/Os makes it well suited to designers needing configurable digital logic and interface flexibility without compromising board space.
This device is appropriate for teams developing medium-complexity programmable solutions who require predictable commercial-temperature operation, a surface-mount 256-LBGA footprint, and RoHS compliance for standard production environments.
Request a quote or submit an inquiry to receive pricing and availability information for the XC3S500E-4FT256C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








