XC3S500E-4FT256C

IC FPGA 190 I/O 256FTBGA
Part Description

Spartan®-3E Field Programmable Gate Array (FPGA) IC 190 368640 10476 256-LBGA

Quantity 838 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O190Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1164Number of Logic Elements/Cells10476
Number of Gates500000ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits368640

Overview of XC3S500E-4FT256C – Spartan®-3E FPGA, 190 I/O, 256-LBGA

The XC3S500E-4FT256C is a Spartan®-3E field programmable gate array (FPGA) supplied in a 256-LBGA package. It delivers moderate logic capacity and embedded memory in a compact, surface-mount footprint for commercial electronic designs.

Designed for applications that require configurable digital logic, the device provides 10,476 logic elements, approximately 0.369 Mbits of embedded memory, and 190 I/O pins while operating over a commercial temperature range.

Key Features

  • Logic Capacity — 10,476 logic elements for implementing custom digital functions and control logic.
  • Embedded Memory — Approximately 0.369 Mbits of on-chip RAM (368,640 bits) to support buffering, state storage, and small FIFOs.
  • Gate Count — 500,000 gates providing the silicon resource scale for medium-complexity designs.
  • I/O — 190 user I/O pins to support multiple peripherals and external interfaces.
  • Power — Core supply range 1.14 V to 1.26 V for the programmable core.
  • Package & Mounting — 256-LBGA (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board layouts.
  • Temperature & Grade — Commercial grade operation from 0°C to 85°C.
  • Compliance — RoHS compliant.

Typical Applications

  • Digital Prototyping — Implement and iterate custom logic and control functions during hardware development.
  • Embedded Control — Integrate state machines, protocol handling, and control logic where moderate logic density is required.
  • Connectivity Interfaces — Provide programmable I/O and glue logic between processors, sensors, and peripherals using the available 190 I/Os.

Unique Advantages

  • Configurable Logic Density: 10,476 logic elements enable implementation of a wide range of medium-complexity designs without external glue logic.
  • On-Chip Memory: Approximately 0.369 Mbits of embedded RAM reduces reliance on external memory for buffering and small data storage.
  • Ample I/O: 190 I/O pins support multiple interfaces and peripheral connections, simplifying board-level design.
  • Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) provides a space-efficient solution for area-constrained PCBs.
  • Commercial Temperature Range: Rated for 0°C to 85°C, suitable for standard commercial electronics applications.
  • Regulatory Compliance: RoHS compliant for use in environmentally regulated manufacturing processes.

Why Choose XC3S500E-4FT256C?

The XC3S500E-4FT256C positions itself as a compact, commercial-grade FPGA option offering a balance of logic resources, embedded memory, and I/O in a small package. Its combination of 10,476 logic elements, roughly 0.369 Mbits of on-chip RAM, and 190 I/Os makes it well suited to designers needing configurable digital logic and interface flexibility without compromising board space.

This device is appropriate for teams developing medium-complexity programmable solutions who require predictable commercial-temperature operation, a surface-mount 256-LBGA footprint, and RoHS compliance for standard production environments.

Request a quote or submit an inquiry to receive pricing and availability information for the XC3S500E-4FT256C.

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