XC3S500E-4FTG256C

The XC3S500E-4FTG256C is a Spartan®-3E field programmable gate array (FPGA) IC providing 10,476 logic elements and approximately 0.369 Mbits of embedded memory in a compact 256-ball LBGA footprint. Designed as a commercial-grade programmable logic device, it combines moderate logic density, on-chip RAM, and a broad I/O complement for integration into space- and cost-conscious system designs.

Key Features

• Core Logic 10,476 logic elements and approximately 500,000 gates provide a moderate-capacity programmable logic fabric for implementing custom digital functions.
• On-Chip Memory Approximately 0.369 Mbits (368,640 bits) of embedded RAM to support data buffering, FIFOs, and small memory structures directly on the device.
• I/O Capacity 190 user I/O pins to interface with peripherals, sensors, and other system components.
• Package & Mounting 256-LBGA package (supplier package: 256-FTBGA, 17×17) with surface-mount mounting suitable for compact PCB layouts.
• Power Specified core supply voltage range of 1.14 V to 1.26 V for predictable power planning.
• Temperature & Grade Commercial operating temperature range of 0 °C to 85 °C and commercial-grade classification for general-purpose applications.
• Environmental Compliance RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Moderate-density programmable logic — Implement custom control, glue-logic, or protocol bridging functions that require ~10k logic elements and embedded RAM.
• Interfaces and peripheral aggregation — Use the 190 I/O pins to consolidate multiple peripheral signals or to create custom protocol interfaces on a single device.
• Compact board-level integration — The 256-LBGA surface-mount package supports space-constrained PCB designs where a small footprint and moderate I/O count are needed.

Unique Advantages

• Balanced logic capacity: 10,476 logic elements and ~500,000 gates deliver a balance of resources for mid-range programmable designs without overprovisioning.
• On-chip RAM for tighter integration: Approximately 0.369 Mbits of embedded memory reduces reliance on external memory for buffering and small data structures, simplifying BOM and layout.
• Generous I/O count: 190 I/O pins enable versatile connectivity options for sensors, interfaces, and peripheral devices.
• Compact, manufacturable package: 256-LBGA (supplier 256-FTBGA, 17×17) surface-mount package supports dense board layouts and automated assembly processes.
• Predictable power envelope: Defined core supply range (1.14 V–1.26 V) aids in power-supply design and system integration.
• Commercial-grade operating range: Rated for 0 °C to 85 °C to match general-purpose electronics and industrial-style environments.
• RoHS compliant: Meets common environmental compliance expectations for electronic components.

Why Choose XC3S500E-4FTG256C?

The XC3S500E-4FTG256C positions itself as a practical choice for designers needing a moderate-density FPGA with substantial I/O and on-chip RAM in a compact LBGA package. Its combination of 10,476 logic elements, approximately 0.369 Mbits of embedded memory, and 190 I/O pins supports a wide range of mid-range programmable tasks while simplifying board-level integration.

This device is appropriate for development teams and product designs that prioritize a balanced mix of logic resources, memory, and I/O within a commercial temperature window, offering a stable platform for cost-sensitive and space-constrained implementations.

Request a quote or submit an inquiry to receive pricing, availability, and ordering details for the XC3S500E-4FTG256C.