XC3S500E-4PQ208I

The XC3S500E-4PQ208I is a Spartan®-3E field programmable gate array (FPGA) offered in a 208-pin BFQFP package. It provides 10,476 logic elements and approximately 0.37 Mbits of embedded memory, making it suitable for designs that require moderate programmable logic capacity with a rich I/O complement.

With an industrial operating temperature range and a low-voltage core supply, this device targets industrial and embedded designs that need reliable digital integration, flexible I/O, and compact surface-mount packaging.

Key Features

• Core Logic  10,476 logic elements and approximately 500,000 gates deliver a programmable fabric for custom digital functions and control logic.
• Embedded Memory  Approximately 0.37 Mbits of on-chip RAM for buffering, FIFOs, and small data storage directly within the FPGA fabric.
• I/O Capacity  158 I/O pins provide a broad interface capability for peripherals, sensors, and external devices.
• Power Supply  Core voltage range of 1.14 V to 1.26 V to match low-voltage system designs.
• Package and Mounting  208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor suitable for compact PCB layouts.
• Operating Range  Industrial-grade operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Standards  RoHS compliant, supporting lead-free manufacturing and regulatory requirements.

Typical Applications

• Custom digital logic and prototyping  Use the programmable fabric and embedded memory to implement custom finite state machines, signal processing blocks, and proof-of-concept designs.
• Industrial control and automation  Industrial-grade temperature range and robust I/O count make the device suitable for control logic, monitoring, and interfacing tasks in automation equipment.
• Sensor and peripheral interfacing  High I/O density supports direct connections to sensors, ADC/DAC front ends, and external peripherals for data acquisition and preprocessing.

Unique Advantages

• Balanced logic and memory capacity:  10,476 logic elements paired with on-chip RAM provide a practical mix for mid-range FPGA designs without external memory dependency.
• Generous I/O count:  158 I/O pins enable flexible system interconnect and simplify routing of multiple peripherals and interfaces.
• Industrial temperature performance:  Rated from -40 °C to 100 °C for reliable operation in demanding thermal environments.
• Compact surface-mount packaging:  208-BFQFP / 208-PQFP (28×28) supports dense PCB layouts while remaining compatible with standard production assembly processes.
• RoHS compliant:  Supports lead-free manufacturing and environmental compliance requirements.

Why Choose XC3S500E-4PQ208I?

The XC3S500E-4PQ208I positions itself as a capable mid-range FPGA solution that combines roughly 10.5k logic elements, approximately 0.37 Mbits of embedded memory, and 158 I/O in a single surface-mount package. Its industrial-grade temperature rating and low-voltage core make it appropriate for embedded and industrial designs that require dependable programmable logic in constrained board real estate.

Designers seeking a compact, RoHS-compliant FPGA with a practical balance of logic, memory, and I/O will find this device suited to a variety of integration tasks where on-chip resources and temperature robustness matter.

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