XC3S500E-4FTG256I

The XC3S500E-4FTG256I is a Spartan®-3E Field Programmable Gate Array (FPGA) in a 256-LBGA package designed for industrial applications. It delivers a balanced combination of logic capacity, on-chip memory, and I/O count for customizable digital designs that require industrial temperature operation and RoHS compliance.

Key Features

• Logic Capacity — 10,476 logic elements and 1,164 CLBs provide configurable digital resources for custom logic and control functions.
• Embedded Memory — Approximately 0.37 Mbits of on-chip RAM (368,640 bits) for data buffering, state storage, and small lookup tables.
• I/O Density — 190 user I/O pins to support multiple peripheral interfaces and signal routing options in compact designs.
• Gate Count — 500,000 gates for partitioning complex designs across programmable fabric.
• Power and Voltage — Core supply range of 1.14 V to 1.26 V to match system power architectures.
• Package and Mounting — 256-LBGA supplier package (256-FTBGA, 17×17) in a surface-mount form factor for space-efficient board layouts.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Regulatory Status — RoHS compliant for environmental regulatory alignment.

Typical Applications

• Industrial Control — Uses the industrial temperature rating and configurable logic to implement motor control, PLC interfaces, and custom automation functions in factory equipment.
• Embedded Systems — Provides on-chip memory and 190 I/O pins suitable for integrating sensors, actuators, and custom peripheral interfaces in embedded designs.
• Prototyping and Custom Logic — Offers a sizable logic element count and gate density for developing and validating custom digital architectures and control algorithms.
• Communications and Interface Bridging — The combination of I/O density and programmable fabric supports protocol adaptation and protocol conversion tasks in communication modules.

Unique Advantages

• High logic integration: 10,476 logic elements and 1,164 CLBs enable consolidation of multiple functions into a single device, reducing board-level component count.
• Embedded memory available: Approximately 0.37 Mbits of on-chip RAM supports local buffering and state retention without external memory.
• Robust operating range: Industrial grade operation from −40 °C to 100 °C broadens deployment options in demanding environments.
• Generous I/O resources: 190 I/O pins allow flexible connectivity to peripherals, sensors, and external interfaces.
• Compact, surface-mount package: 256-LBGA (256-FTBGA, 17×17) enables high-density board designs while maintaining thermal and mechanical stability.
• Regulatory compliance: RoHS status supports environmental compliance requirements for commercial and industrial products.

Why Choose XC3S500E-4FTG256I?

The XC3S500E-4FTG256I delivers a practical balance of programmable logic, embedded memory, and I/O capacity in an industrially rated FPGA package. Its combination of 10,476 logic elements, approximately 0.37 Mbits of on-chip RAM, and 190 I/O pins makes it well suited for designers seeking a single-device solution to consolidate custom digital functions while meeting industrial temperature and RoHS requirements.

This device is appropriate for engineers and procurement teams building industrial control, embedded, or communication interface solutions that require scalable programmable logic, compact packaging, and clear, verifiable specifications for system integration and long-term deployment.

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