XC3S500E-4FT256I

The XC3S500E-4FT256I is a Spartan®-3E Field Programmable Gate Array (FPGA) IC from AMD, offered in a 256-LBGA package. It provides a mid-range combination of programmable logic, embedded RAM and I/O resources that address designs requiring on-chip memory and substantial interfacing capacity.

With 10,476 logic elements and approximately 0.369 Mbits of embedded memory, this device targets applications that need a balance of logic density, on-chip storage and a broad I/O complement, while supporting industrial temperature operation.

Key Features

• Programmable Logic 10,476 logic elements deliver mid-range on-chip logic capacity for custom digital functions and glue logic.
• Embedded Memory Approximately 0.369 Mbits of on-chip RAM (368,640 total bits) for buffering, FIFOs and small data tables.
• I/O and Gate Count 190 user I/O pins and 500,000 gates provide extensive external connectivity and functional density for complex designs.
• Power Supply Core supply range from 1.14 V to 1.26 V to match system power-rail requirements within the specified range.
• Package & Mounting Available in a 256-LBGA package (supplier device package: 256-FTBGA, 17×17) with surface-mount mounting for PCB assembly.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Regulatory Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control Use the device’s industrial temperature rating and 190 I/O to implement motor control interfaces, sensor aggregation and deterministic control logic.
• Embedded System Glue Logic Mid-range logic capacity and on-chip RAM make the part suitable for protocol bridging, custom peripherals and timing-critical glue between processors and peripherals.
• Data Buffering and Interface Expansion Approximately 0.369 Mbits of embedded RAM and abundant I/O support local buffering, FIFOs and parallel/serial interface handling on constrained PCBs.

Unique Advantages

• Balanced Logic and Memory: 10,476 logic elements paired with 368,640 bits of RAM provide a practical balance for designs that require both combinational/sequential logic and on-chip storage.
• Extensive I/O Capacity: 190 user I/O pins enable flexible interfacing to sensors, buses and peripherals without immediate need for external I/O expanders.
• Industrial Robustness: Rated for −40 °C to 100 °C operation, making it suitable for systems subjected to wide temperature ranges.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) footprint supports densely populated PCBs while providing ample I/O and logic resources.
• Regulatory Readiness: RoHS compliance helps simplify integration into lead-free manufacturing flows.

Why Choose XC3S500E-4FT256I?

The XC3S500E-4FT256I offers a practical mix of logic elements, embedded memory and I/O resources in a compact 256-LBGA footprint, combined with industrial temperature operation and RoHS compliance. It is positioned for designers seeking a mid-range Spartan®-3E FPGA solution that balances integration and robustness for embedded and control-oriented applications.

This device is well suited to engineering teams that need scalable logic capacity with on-chip RAM and broad interfacing options while maintaining compatibility with surface-mount production and industrial operating conditions.

Request a quote today to obtain pricing and availability for the XC3S500E-4FT256I and to discuss how it can fit your next design.