XC3S500E-4FGG320I

The XC3S500E-4FGG320I is a Spartan®-3E family FPGA IC from AMD, delivering mid-range programmable logic in a 320-ball BGA package. It combines on-chip logic, embedded memory and comprehensive I/O to serve industrial and embedded designs requiring a balance of integration and configurability.

Designed for surface-mount assembly and industrial-grade operation, this device targets applications that need approximately 10,476 logic elements, extensive I/O, and embedded memory while operating over a wide temperature and low-voltage supply window.

Key Features

• Programmable Logic  Approximately 10,476 logic elements (equivalent to ~500,000 gates) for implementing custom digital functions and state machines.
• Embedded Memory  Approximately 0.37 Mbits of on-chip RAM for buffering, small FPGA-based data structures and local storage.
• I/O Capability  232 general-purpose I/O pins to support parallel interfaces, signaling and multiple peripheral connections.
• Power Supply  Operates from a core voltage supply range of 1.14 V to 1.26 V, suitable for low-voltage FPGA designs.
• Package & Mounting  320-BGA (supplier package: 320-FBGA, 19×19) in a surface-mount form factor for compact board layouts.
• Industrial Grade Temperature Range  Rated for −40°C to 100°C operation to meet industrial environmental requirements.
• Standards & Compliance  RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• Industrial Automation  Implement motor control logic, I/O aggregation and real-time signal processing within industrial systems leveraging the device’s I/O density and industrial temperature rating.
• Embedded Control Systems  Use the FPGA for custom control algorithms, state machines and peripheral interfacing in embedded products that benefit from on-chip logic and memory.
• Communications & Networking  Deploy as protocol bridges, parallel interface controllers or custom packet-handling blocks where multiple I/Os and programmable logic are required.
• Prototype & Low-Volume Systems  Rapidly iterate hardware functions and integrate custom IP for proof-of-concept and low-volume production builds.

Unique Advantages

• Balanced Logic Capacity: Approximately 10,476 logic elements provide a mid-range resource set suitable for a wide set of custom digital functions without over-specifying capacity.
• Generous I/O Count: 232 I/O pins enable direct interfacing to multiple peripherals, buses and sensors, reducing the need for external I/O expanders.
• Compact BGA Packaging: The 320-BGA package supports high-density PCB designs while maintaining robust electrical performance for production assemblies.
• Industrial Temperature Specified: Operation from −40°C to 100°C supports deployment in harsher environments common to industrial applications.
• Low-Voltage Core: A 1.14 V–1.26 V supply range enables integration into low-voltage power architectures.
• Regulatory Compliance: RoHS compliance helps streamline lead-free manufacturing and regulatory adherence.

Why Choose XC3S500E-4FGG320I?

The XC3S500E-4FGG320I positions itself as a practical, industrial-grade FPGA option when designers need a mid-range mix of logic, embedded memory and extensive I/O in a compact BGA footprint. Its specification set is suited to teams building industrial automation, embedded control or communications hardware that requires deterministic, configurable logic resources.

Backed by AMD’s Spartan®-3E family, the device offers a balance of integration and robustness for designs that value predictable operating temperature range, RoHS compliance and a surface-mount package for production-level assemblies.

If you’d like pricing, availability or to request a formal quote for the XC3S500E-4FGG320I, submit a quote request or contact sales for a tailored response.