XC3S500E-4CPG132I

The XC3S500E-4CPG132I is a Spartan®-3E field programmable gate array (FPGA) from AMD designed to deliver mid-range programmable logic resources in a compact surface-mount package. It provides 10,476 logic elements and approximately 0.37 Mbits of embedded memory, making it suitable for applications that require moderate logic density and on-chip buffering.

Targeted at industrial applications, this device offers 92 user I/O pins, a core voltage range of 1.14 V to 1.26 V, and an operating temperature range of –40 °C to 100 °C, providing a balance of integration, configurability, and environmental robustness for embedded designs.

Key Features

• Core Logic: 10,476 logic elements (cells) for implementing custom digital logic and finite-state machines.
• Embedded Memory: Approximately 0.37 Mbits (368,640 bits) of on-chip RAM for buffering, FIFOs, and small data storage tasks.
• I/O Capacity: 92 user I/O pins to interface with sensors, peripherals, and external logic devices.
• Device Scale: Approximately 500,000 gates providing an overall measure of device complexity.
• Power: Core supply voltage range of 1.14 V to 1.26 V for compatibility with low-voltage power domains.
• Package & Mounting: Surface-mount 132-TFBGA / 132-CSPBGA (8×8) package for compact board-level integration.
• Temperature & Grade: Industrial grade operation over –40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Industrial Control: Implement custom control logic and I/O interfacing that benefit from the device’s industrial temperature range and 92 I/O pins.
• Embedded Systems: Use embedded memory and logic elements to implement glue logic, protocol handlers, and small processing accelerators in compact systems.
• Communications Interfaces: Realize protocol bridging and data buffering functions using on-chip RAM and the available gate/logic resources.
• Prototyping & Evaluation: Develop and validate custom logic designs that require a mid-range FPGA with a compact BGA package.

Unique Advantages

• Balanced Logic Density: 10,476 logic elements and ~500,000 gates provide a mid-range resource set suitable for many embedded and control functions without excess overhead.
• On-Chip Memory for Buffering: Approximately 0.37 Mbits of embedded RAM reduces the need for external memory in many buffering and FIFO use cases.
• Robust Operating Range: Industrial grade rated from –40 °C to 100 °C, enabling reliable operation across a wide range of environments.
• Compact Surface-Mount Package: 132-CSPBGA (8×8) enables space-efficient board layouts while providing a high pin count for system integration.
• Low-Voltage Core: 1.14 V to 1.26 V core supply supports modern low-voltage power architectures.
• Regulatory Compliance: RoHS compliance supports environmentally conscious designs and manufacturing requirements.

Why Choose XC3S500E-4CPG132I?

The XC3S500E-4CPG132I positions itself as a practical mid-range FPGA option for engineers who need a compact, industrial-grade programmable device with a balanced mix of logic, memory, and I/O. Its combination of 10,476 logic elements, approximately 0.37 Mbits of embedded memory, and 92 I/O pins makes it well suited for embedded controls, interface logic, and communication-focused designs.

Backed by AMD manufacturing, this part offers a clear specification set—compact 132-CSPBGA packaging, low-voltage core operation, and wide temperature capability—delivering long-term value for projects that require reliable, reconfigurable logic in industrial environments.

Request a quote or submit an inquiry to check availability and pricing for the XC3S500E-4CPG132I.