XC3S5000-5FGG900C

The XC3S5000-5FGG900C is a Spartan®-3 field programmable gate array (FPGA) offered in a 900-BBGA package. It provides a high count of logic elements, substantial on-chip memory, and a large number of I/O pins for integration into complex digital designs.

Built for commercial-grade applications, this device balances integration and capacity with a defined operating voltage and temperature envelope to support reliable deployment in standard commercial environments.

Key Features

• Core Logic  Approximately 74,880 logic elements provide capacity for complex custom logic implementations and hardware acceleration.
• Embedded Memory  Approximately 1.92 Mbits of on-chip RAM (1,916,928 bits) for buffering, state storage, and local data processing.
• I/O Density  633 programmable I/O pins to support multiple external interfaces and high pin-count system connectivity.
• Gate Count  5,000,000 gates enabling substantial logic integration for feature-rich designs.
• Package & Mounting  900-BBGA (supplier device package: 900-FBGA, 31×31) surface-mount package for compact, high-density board layouts.
• Power  Specified supply voltage range of 1.14 V to 1.26 V to match system voltage requirements and ensure predictable power behavior.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C for standard commercial applications.
• Regulatory  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density custom logic  Use the device’s 74,880 logic elements and 5,000,000 gates to implement complex, application-specific digital functions.
• I/O-heavy systems  The 633 I/O pins accommodate multiple external interfaces and peripherals, simplifying board-level integration.
• Embedded memory buffering  Approximately 1.92 Mbits of on-chip RAM supports local data storage, buffering, and state machines within the FPGA fabric.

Unique Advantages

• High logic capacity: Large logic element count allows consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip memory: Nearly 1.92 Mbits of embedded RAM enables efficient local data handling and reduces external memory dependency.
• Extensive I/O availability: 633 I/O pins provide flexibility to interface with numerous peripherals and support parallel connectivity.
• Compact, high-density package: The 900-BBGA (900-FBGA, 31×31) surface-mount package supports compact board designs while providing a high pin count.
• Defined commercial operating range: Rated for 0 °C to 85 °C to match typical commercial-environment system requirements.
• RoHS compliant: Meets common environmental compliance expectations for modern electronic manufacturing.

Why Choose XC3S5000-5FGG900C?

The XC3S5000-5FGG900C offers a combination of substantial logic resources, embedded memory, and extensive I/O in a compact 900-BBGA package, making it suitable for designers who need to integrate complex digital functions into commercial-grade systems. Its clear supply voltage and temperature specifications help ensure predictable behavior during development and deployment.

This device is appropriate for engineering teams seeking a high-capacity FPGA platform that supports consolidation of multiple functions, on-chip buffering needs, and high pin-count interfacing while complying with RoHS requirements.

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