XC3S5000-5FG676C

The XC3S5000-5FG676C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD offering high logic density and extensive I/O in a compact BGA package. With 74,880 logic elements, approximately 1.92 Mbits of embedded memory and up to 489 I/O pins, it is designed for applications that require substantial programmable logic and large I/O counts within a surface-mount 676-FBGA (27×27) footprint.

Key Features

• Core Logic 74,880 logic elements providing a substantial programmable resource for custom digital logic implementations.
• Embedded Memory Approximately 1.92 Mbits of on-chip RAM to support buffering, state storage and data-path implementations.
• Large I/O Count 489 available I/O pins to accommodate complex interfacing and high-density peripheral connections.
• Gate Equivalent Approximately 5,000,000 gates for wide-ranging logic and control functions.
• Power Core supply voltage range of 1.14 V to 1.26 V for compatibility with target power domains.
• Package & Mounting 676-BGA (supplier package: 676-FBGA, 27×27) in a surface-mount form factor for board-level integration.
• Temperature & Grade Commercial grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Embedded Systems — Implement control logic, custom processors, and data-path accelerators using the device's large logic capacity and embedded RAM.
• Data Acquisition & Processing — Use the broad I/O and on-chip memory to aggregate, buffer, and preprocess sensor or data-stream inputs.
• Interface Bridging — Translate and manage multiple high-density I/O interfaces within a single FPGA package.
• Prototyping & Custom Logic — Rapidly prototype complex digital designs that require hundreds of thousands of gates and extensive I/O connectivity.

Unique Advantages

• High Logic Capacity: 74,880 logic elements allow implementation of complex state machines, datapaths and custom accelerators without external logic expansion.
• Significant On-Chip Memory: Approximately 1.92 Mbits of embedded RAM reduces the need for external memory in many buffering and caching tasks.
• Extensive I/O: 489 I/O pins support dense peripheral and interface requirements, simplifying board-level routing for multi-channel designs.
• Compact BGA Package: 676-FBGA (27×27) provides a high-density mounting option for space-constrained PCBs while keeping the device surface-mount compatible.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match standard commercial deployments and environments.
• Regulatory Compliance: RoHS compliant to meet common environmental manufacturing requirements.

Why Choose XC3S5000-5FG676C?

The XC3S5000-5FG676C positions itself as a high-capacity Spartan®-3 FPGA suitable for designs that demand large programmable logic resources, substantial embedded memory and a high pin count in a compact BGA package. Its combination of approximately 74,880 logic elements, ~1.92 Mbits of on-chip RAM and 489 I/Os supports integrated digital designs where density and connectivity are priorities.

This commercial-grade, surface-mount FPGA offers a balance of logic capacity, I/O density and packaging for engineers building complex embedded systems, data acquisition modules, interface bridges and prototype platforms. Its RoHS compliance and defined voltage and temperature ranges provide verifiable parameters for procurement and design planning.

Request a quote or submit an inquiry for pricing and availability of the XC3S5000-5FG676C to support your next design or production run.