XC3S5000-4FGG676C

The XC3S5000-4FGG676C is a Spartan®-3 field programmable gate array (FPGA) designed for commercial applications. It provides a large logic capacity with 8,320 CLBs and 74,880 logic elements, along with approximately 1.92 Mbits of on-chip RAM and up to 489 user I/O pins, enabling dense, I/O-rich designs.

Built in a 676-ball BGA package and compliant with RoHS, this FPGA supports designs that require high logic count, substantial embedded memory, and a high pin count within a surface-mount form factor.

Key Features

• Core Logic 8,320 CLBs and 74,880 logic elements provide significant gate capacity for complex digital designs (5,000,000 equivalent gates).
• On-chip Memory Approximately 1.92 Mbits of embedded RAM to support buffering, state storage, and intermediate data processing.
• I/O Density 489 user I/Os enable extensive external interfacing for multi-channel systems and high-pin-count peripherals.
• Power Supply Operates from a core voltage supply range of 1.14 V to 1.26 V for the FPGA core.
• Package & Mounting 676-BGA package (supplier device package: 676-FBGA (27x27)), surface-mount mounting for board-level integration.
• Operating Range Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Deploy programmable logic and on-chip memory to implement control, data processing, and custom logic functions in commercial products.
• High-Density I/O Interfaces — Use the large number of I/Os to aggregate and route signals for multi-channel sensor arrays, I/O expansion, or board-level bridging.
• FPGA-Based Prototyping — Leverage the substantial logic and RAM resources for prototyping complex digital designs and validating system-level functions.
• Data Buffering and Processing — Utilize embedded RAM and logic capacity for intermediate data buffering, packet handling, or custom processing pipelines.

Unique Advantages

• High Logic Capacity: 74,880 logic elements enable implementation of sizable digital functions without external glue logic.
• Significant On-Chip Memory: Approximately 1.92 Mbits of embedded RAM reduces the need for external memory in many buffering and stateful applications.
• Extensive I/O Count: 489 I/Os support complex interfacing requirements and simplify board routing for multi-signal systems.
• Compact BGA Package: 676-BGA (676-FBGA (27x27)) provides high pin density in a surface-mount form factor suitable for space-constrained PCBs.
• Commercial Temperature Rating: Operation from 0 °C to 85 °C aligns with standard commercial deployments.
• RoHS Compliant: Meets lead-free manufacturing requirements for regulatory and assembly compatibility.

Why Choose XC3S5000-4FGG676C?

The XC3S5000-4FGG676C positions itself as a high-capacity, I/O-rich Spartan®-3 FPGA option for commercial designs that require substantial logic, embedded RAM, and broad external connectivity in a BGA surface-mount package. Its combination of 74,880 logic elements, approximately 1.92 Mbits of on-chip memory, and 489 I/Os offers designers the ability to integrate complex digital functions while minimizing external components.

This device is well suited to engineering teams and procurement groups developing commercial embedded systems, board-level prototypes, and I/O-dense solutions who need verified, RoHS-compliant FPGA hardware with a defined operating voltage and temperature range.

Request a quote or submit an inquiry to obtain pricing and lead-time information for the XC3S5000-4FGG676C.