XC3S5000-4FG900C

The XC3S5000-4FG900C is a Spartan®-3 field programmable gate array (FPGA) offered in a 900-ball BGA package. It provides a high logic element count and substantial on-chip memory in a surface-mount 900-BBGA (supplier package: 900-FBGA, 31×31) footprint for commercial-temperature applications.

With 8,320 CLBs, 74,880 logic elements and approximately 1.917 Mbits of embedded memory, this device is aimed at designs that require dense logic integration, significant embedded RAM, and wide I/O capacity within a compact package and a defined commercial operating range.

Key Features

• Core Logic 8,320 CLBs and 74,880 logic elements provide large on-chip logic capacity for complex digital designs.
• Embedded Memory Approximately 1.917 Mbits of total RAM bits available for data buffering, state storage, and on-chip tables.
• I/O Capability 633 I/O pins to support a wide range of external interfaces and high-pin-count system integration.
• Gate Count Approximately 5,000,000 gates for substantial combinational and sequential logic implementation.
• Power Core supply voltage specified between 1.14 V and 1.26 V for device operation.
• Package & Mounting Surface-mount 900-BBGA package (supplier package 900-FBGA, 31×31) for compact board-level integration.
• Temperature & Grade Commercial grade device with an operating temperature range of 0°C to 85°C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density logic implementations — Use the 74,880 logic elements and 8,320 CLBs to implement complex combinational and sequential logic functions on-chip.
• Memory-centric functions — Approximately 1.917 Mbits of embedded RAM supports buffering, look-up tables, and state storage for data-path and control logic.
• I/O-intensive systems — 633 I/O pins enable connection to multiple peripherals, buses, and external logic interfaces.

Unique Advantages

• High logic capacity: 74,880 logic elements and 8,320 CLBs enable dense integration of digital functions without external logic.
• Substantial on-chip memory: Approximately 1.917 Mbits of embedded RAM reduces dependence on external memory components for many applications.
• Extensive connectivity: 633 I/O pins support complex interconnect topologies and multiple peripheral interfaces.
• Compact BGA footprint: 900-BBGA / 900-FBGA (31×31) simplifies board layout for space-constrained designs.
• Commercial temperature rating: Specified operation from 0°C to 85°C for standard commercial deployments.
• RoHS compliant: Meets environmental requirements for lead-free assembly.

Why Choose XC3S5000-4FG900C?

The XC3S5000-4FG900C offers a balance of high logic density, embedded memory, and wide I/O capability in a compact 900-ball BGA package for commercial-temperature applications. Its combination of 8,320 CLBs, approximately 1.917 Mbits of on-chip RAM, and 633 I/O pins makes it suitable for designs that require integrated digital functionality and significant interfacing without expanding board-level component counts.

This device is well suited to engineers and teams targeting dense FPGA-based implementations where on-chip resources, package size, and standard commercial operating range are key selection criteria.

Request a quote or submit an inquiry for the XC3S5000-4FG900C to receive pricing and availability information.