XC3S5000-4FGG1156C

The XC3S5000-4FGG1156C is a Spartan®-3 Field Programmable Gate Array (FPGA) from AMD designed to deliver high-density programmable logic and embedded memory in a compact FCBGA package. Its architecture provides a combination of logic elements, on-chip RAM, and a large I/O count for complex, configurable digital designs.

Built for commercial-grade applications, the device offers a broad operating voltage range and a 1156-ball FCBGA surface-mount package suitable for space-constrained boards where high connectivity and integration are required.

Key Features

• Core Logic — 8,320 CLBs and 74,880 logic elements (cells) provide substantial programmable logic capacity for implementing complex combinational and sequential functions.
• Embedded Memory — Approximately 1.92 Mbits of on-chip RAM enables local data buffering, look-up tables, and application-specific memory structures without external memory.
• I/O and Gate Density — 633 user I/O pins and an estimated 5,000,000 gates support dense interfacing and large-scale logic integration.
• Power and Operating Range — Core supply voltage range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C align with standard commercial deployments.
• Package and Mounting — 1156-FCBGA (35 × 35 mm) surface-mount package delivers a compact footprint with high pin-count connectivity.
• Compliance — RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

• High-density logic implementations — Use the 74,880 logic elements and 8,320 CLBs to implement large custom logic blocks and application-specific accelerators.
• Multi-I/O interface designs — Leverage 633 I/O pins to consolidate multiple interfaces or bridge parallel and serial buses on a single device.
• Memory-intensive functions — Approximately 1.92 Mbits of on-chip RAM supports buffering, FIFOs, and small data-store needs without external memory.

Unique Advantages

• High logic capacity: Large CLB and logic element counts enable complex designs to be implemented on a single FPGA, reducing system component count.
• On-chip memory: Nearly 1.92 Mbits of embedded RAM minimizes dependence on external memory, simplifying board layout and improving data locality.
• Extensive I/O: 633 I/Os provide flexibility for high-pin-count designs, multiple peripheral connections, and parallel data paths.
• Compact, high-density package: The 1156-FCBGA (35×35) surface-mount package delivers a high pin count in a compact footprint for space-constrained applications.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation and a defined core voltage window, suitable for standard commercial deployments.
• Regulatory readiness: RoHS compliance supports integration into lead-free manufacturing processes.

Why Choose XC3S5000-4FGG1156C?

The XC3S5000-4FGG1156C positions itself as a balanced, high-capacity Spartan®-3 FPGA option from AMD, combining substantial programmable logic, embedded RAM, and a very large I/O count in a compact FCBGA package. It is well suited for designers who need to integrate complex logic, multiple interfaces, and on-chip memory within a commercial-temperature design.

For teams focused on consolidation and integration, this device offers the capacity and connectivity to reduce system BOM and simplify board design while staying within commercial operating parameters and RoHS requirements.

If you would like pricing, availability, or a formal quote for the XC3S5000-4FGG1156C, please submit a request and our team will assist with your procurement needs.