XC3S5000-4FG1156C

The XC3S5000-4FG1156C is a Spartan®-3 family Field Programmable Gate Array (FPGA) from AMD, provided in a high-density 1156-ball BGA package. It delivers a balance of programmable logic capacity, on-chip memory, and abundant I/O for commercial embedded and digital designs.

With approximately 74,880 logic elements, roughly 1.92 Mbits of embedded memory and 489 user I/O pins, this device is suited for designs requiring significant logic density, substantial I/O connectivity and moderate on-chip storage, all in a surface-mount 1156-FBGA (35×35) package.

Key Features

• Programmable Logic Capacity – Approximately 74,880 logic elements provide substantial resources for implementing complex custom digital logic and control functions.
• Embedded Memory – Approximately 1.92 Mbits of on-chip RAM support buffering, small data structures and local storage for logic-intensive tasks.
• I/O Density – 489 user I/O pins enable extensive external interfacing for multi-channel I/O, peripherals and board-level connectivity.
• Gate Count – A device gate equivalent of 5,000,000 offers a useful reference for comparing design integration and complexity.
• Power – Core voltage supply range of 1.14 V to 1.26 V for integration into regulated power domains.
• Package and Mounting – Surface-mount 1156-BBGA / supplier package 1156-FBGA (35×35) provides a compact, high-pin-count footprint for board-level designs.
• Temperature and Grade – Commercial grade operation from 0°C to 85°C, suitable for typical commercial and industrial-environment consumer applications.
• Environmental Compliance – RoHS compliant for reduced hazardous substances in manufacturing and assembly.

Typical Applications

• Custom digital logic and prototyping – Use the device’s ~74,880 logic elements to implement custom state machines, data paths and application-specific accelerators during development and deployment.
• High-density I/O systems – 489 user I/O pins accommodate multi-channel interfaces, sensor arrays and board-level communication requirements.
• Embedded buffering and local storage – Approximately 1.92 Mbits of embedded memory support frame buffering, FIFOs and small local data stores for latency-sensitive functions.

Unique Advantages

• Substantial logic integration: Approximately 74,880 logic elements reduce the need for multiple discrete devices by consolidating complex logic into a single FPGA.
• High I/O count: 489 I/Os simplify board design for multi-signal systems and enable flexible external connectivity without heavy multiplexing.
• On-chip memory for performance: The roughly 1.92 Mbits of embedded RAM allow localized storage to improve throughput and reduce external memory dependencies.
• Compact BGA packaging: The 1156-FBGA (35×35) package provides a dense footprint that supports high-pin integration while maintaining a compact board area.
• Commercial temperature rating: Operation from 0°C to 85°C aligns with standard commercial product requirements for many embedded applications.
• RoHS compliant: Environmentally compliant manufacturing and assembly compatibility for supply chain needs.

Why Choose XC3S5000-4FG1156C?

The XC3S5000-4FG1156C positions itself as a high-density, commercially rated Spartan®-3 FPGA option from AMD, combining a large logic resource pool, significant embedded memory and a very high I/O count within a compact 1156-ball BGA package. These characteristics make it well suited for engineers building complex digital systems that demand substantial programmable logic and board-level connectivity.

This part is appropriate for design teams and product developers who require scalable logic capacity, local memory for buffering and extensive I/O without moving to a larger multi-chip solution. Its commercial temperature rating and RoHS compliance support mainstream embedded product lifecycles and manufacturing requirements.

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